nanotrends writes "The IEEE Spectrum is running a piece entitled 'Moore's Law Meets Its Match', about the system-on-package (SOP) approach to technology. The (SOP) approach combines Integrated Circuits (ICs) with micrometer-scale thin-film versions of discrete components, and it embeds everything in a new type of package so small that eventually handhelds will become anything from multi-to megafunction devices. This integration is actually developing at a rate faster than Moore's law." From the article: "SOP technology represents a radically different approach to systems. It shrinks bulky circuit boards with their many components and makes them nearly disappear. In effect, SOP sets up a new law for system integration. It holds that as the components shrink and the boards all but disappear, the component density will double every year or so, and the number of system functions in an SOP package will increase in the same proportion."
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