Roland Piquepaille writes "Engineers at the University of Wisconsin-Madison have isolated a single-crystal film of semiconductor from the substrate on which it is built. Then they transferred this very thin film — 200 nanometers thick — on plastic. Both sides of the film can host active components and several layers can be stacked, opening the way to very powerful 3-D flexible computer chips. Besides computer chips, this technique could be used for solar cells, smart cards, RFID tags or active-matrix flat panel displays."
Attend or create a Slashdot 20th anniversary party! DEAL: For $25 - Add A Second Phone Number To Your Smartphone for life! Use promo code SLASHDOT25. Check out the new SourceForge HTML5 Internet speed test. ×