from the runs-almost-as-hot-as-the-athlon dept.
Weedstock writes: "EE Times has an article about Intel's next decade roadmap. It explains what are the current issues with the actual "plastic bumped organic land grid array" packaging technology and how it will be modified into a "bumpless package with built-up layers" to accomodate billion-transistor processors."
The computer is to the information industry roughly what the
central power station is to the electrical industry.
-- Peter Drucker