Yep. BGAs are difficult to rework, but perhaps the real blame for this can be aimed at the EU when they forced the electronics industry to transition to lead free solder 15 years ago, while not touching other industries, like car batteries.
Solder used to be 60%tin 40% lead. Lead was a great modifier to give ductility to solder joints. By going to almost 100% tin, solder joints are now more brittle, thus micro BGAs suffer more from thermal expansion fractures and shear fractures from physical drops.
The crazy thing, is the transition, which cost the industry Billions, was based on unproven science that tin/lead solder leached in ground fill rubbish dumps. It doesn't unless you have acid. But here we are today, stuck with a EU mandated change that increases energy to manufacturer and decreases reliability (see tin asker problem as well).