Submission + - Intel Unveils 22nm 3D Tri-gate (add. coverage) (hothardware.com)
MojoKid writes: "Intel announced a major technology advancement today in a move that fundamentally changes how the company will build processors and other devices in the years to come. Intel is adopting what it calls Tri-Gate (3D) transistors. What Intel has done is develop a 3D gate structure that creates a fin of substrate material through which the gate passes. This actually increases the size of the inversion layer (allowing for higher drive current) but minimizes the power lost to leakage. Intel's diagrams indicate that the company is moving to SOI as well. Ivy Bridge-based Intel Core family processors will be the first high-volume chips to use 3-D Tri-Gate transistors. Ivy Bridge is slated for high-volume production readiness by the end of this year."