Vandermar writes: "IBM's new production method uses an advanced insulation material -- a low-k dielectric -- that protects the millions of individual copper circuits on a chip." Apparently it works at sizes down to 0.13 micron and the insulation itself is primarily silk. IBM says it will be using this technology for its Power 4 processor, but with their technology sharing with Transmeta and AMD can we expect to see this enhancement in their chips?"
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