After nearly two decades of touchscreen dominance, QWERTY smartphones are staging a niche comeback, with Clicks and Unihertz unveiling new physical-keyboard phones at CES 2026. Gizmodo reports: At CES 2026, Clicks, the company behind the Clicks keyboard case and the new Power Keyboard, announced plans to sell the Communicator, a "second phone" with a QWERTY keypad. Clicks pitches the $500 phone, launching later this year, as a device primarily intended for messaging -- sending texts, DMs, Slack messages, whatever. The company didn't have a functional unit -- only a mockup dummy to fondle at the show -- but it looked cool enough, even if it'll be a very niche product. It's a cool idea, but how many people will carry a companion phone to their main phone just to shoot off a few DMs? $500 is a lot to ask for that satisfaction.

But Clicks isn't the only one trying to bring back QWERTY phones. Unihertz, makers of the really tiny Jelly Android phones and also Tank phones with massive battery capacities, also teased a new phone with a physical keyboard. The Titan 2 Elite seems to be a less gimmicky version of the Titan 2, which itself was a BlackBerry Passport knockoff but with a bizarre square screen on the backside.

Look closely, and there are some weird similarities between the Clicks Communicator and the Titan 2 Elite. We don't have dimension specs yet, but the screens seem to have the same rounded corners, and even the hole-punch camera is in the same upper-left corner. The only difference seems to be the keyboards; the Communicator uses individual keys, whereas the Titan 2 Elite's keyboard is more BlackBerry-esque. After digging into the Clicks Communicator's specs, a few other features stood out that Slashdotters might appreciate. There's a dedicated 3.5mm headphone jack, a physical "kill switch" (essentially an alert slider), fingerprint scanner and even a customizable notification LED. The last time we saw a phone with a dedicated notification LED was around 2019!

Former Intel CEO Craig Barrett urged the rehiring of Pat Gelsinger, who was abruptly fired two months ago, arguing he should "finish the job he has aptly handled over the past few years."

"Pat Gelsinger did a great job resuscitating the technology development team," Barrett wrote, criticizing the company's current leadership under "a CFO and a product manager." He suggested firing the Intel board rather than splitting the company.

Barrett's comments come in response to proposals from four former board members advocating for Intel's separation into design and manufacturing businesses. Barrett dismissed these board members as "two academics and two former government bureaucrats" lacking semiconductor industry expertise.

The former CEO praised Intel's technological resurgence under Gelsinger, noting its capabilities now match industry leader TSMC's 2nm technology, with additional advances in imaging technology and backside power delivery to complex chips. "Intel is backâ"from a technology point of view," Barrett wrote, arguing the best path forward is building on current momentum rather than organizational restructuring that would disrupt the company's 100,000-plus employees across multiple continents.

Longtime Slashdot reader davidwr writes: Winners of the 34th First Annual Ig Nobel Prizes included studies on hair swirling (natural, not from grade-school bathroom torture), mammals that breath through their anal orifices, and a study on pigeon-guided missiles. There were also prizes for the study of the swimming abilities of a formerly-living trout. "Honors" were also bestowed for research in coin-flipping (no, it's not 50/50), why cows spew milk, and drunken worms, among other topics. Prizes included $10,000,000,000 (in now-worthless Zimbabwe dollars) and items related to Murphy's Law.

Media coverage includes AP, CNN, Gizmodo, Ars Technica, and by the time you read this, probably much more.

Intel has announced significant progress on its 18A process technology, with lead products successfully powering on and booting operating systems. The company's Panther Lake client processor and Clearwater Forest server chip, both built on 18A, achieved these milestones less than two quarters after tape-out. The 18A node, featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery, is on track for production in 2025.

Intel released the 18A Process Design Kit 1.0 in July, enabling foundry customers to leverage these advanced technologies in their designs. "Intel is out ahead of everyone else in the industry with these innovations," Kevin O'Buckley, Intel's new head of Foundry Services stated, highlighting the node's potential to drive next-generation AI solutions. Clearwater Forest will be the industry's first mass-produced, high-performance chip combining RibbonFET, PowerVia, and Foveros Direct 3D packaging technology. It also utilizes Intel's 3-T base-die technology, showcasing the company's systems foundry approach. Intel expects its first external customer to tape out on 18A in the first half of 2025. EDA and IP partners are updating their tools to support customer designs on the new node. The success of 18A is crucial for Intel's ambitions to regain process leadership and grow its foundry business.

An anonymous reader quotes a report from Tom's Hardware: TSMC announced its leading-edge 1.6nm-class process technology today, a new A16 manufacturing process that will be the company's first Angstrom-class production node and promises to outperform its predecessor, N2P, by a significant margin. The technology's most important innovation will be its backside power delivery network (BSPDN). Just like TSMC's 2nm-class nodes (N2, N2P, and N2X), the company's 1.6nm-class fabrication process will rely on gate-all-around (GAA) nanosheet transistors, but unlike the current and next-generation nodes, this one uses backside power delivery dubbed Super Power Rail. Transistor and BSPDN innovations enable tangible performance and efficiency improvements compared to TSMC's N2P: the new node promises an up to 10% higher clock rate at the same voltage and a 15%-20% lower power consumption at the same frequency and complexity. In addition, the new technology could enable 7%-10% higher transistor density, depending on the actual design.

The most important innovation of TSMC's A16 process, which was unveiled at the company's North American Technology Symposium 2024, is the introduction of the Super Power Rail (SPR), a sophisticated backside power delivery network (BSPDN). This technology is tailored specifically for AI and HPC processors that tend to have both complex signal wiring and dense power delivery networks. Backside power delivery will be implemented into many upcoming process technologies as it allows for an increase in transistor density and improved power delivery, which affects performance. Meanwhile, there are several ways to implement a BSPDN. TSMC's Super Power Rail plugs the backside power delivery network to each transistor's source and drain using a special contact that also reduces resistance to get the maximum performance and power efficiency possible. From a production perspective, this is one of the most complex BSPDN implementations and is more complex than Intel's Power Via. Volume production of A16 is slated for the second half of 2026. "Therefore, actual A16-made products will likely debut in 2027," notes the report. "This timeline positions A16 to potentially compete with Intel's 14A node, which will be Intel's most advanced node at the time."

At Lenovo Tech World '23 in Austin, Texas, yesterday, Motorola demoed a bendable, bracelet-like smartphone that can wrap around your wrist. Ars Technica reports: On stage at the event, Lexi Valasek, 312 Labs innovation strategy and product research Lead for Motorola Mobility, proudly held a prototype. The smartphone looked ordinary to start: a slab of OLED with a chassis that's a bold orange on the backside. But Valasek quickly bent the phone into an arch shape, where it stood on her hand before she wrapped it around her wrist like a cuff. The phone seemed to adapt to its new positioning rapidly, quickly showing a large clock, making the device feel like a smartwatch.

Interestingly, Valasek placed the phone around a silver band already wrapped around her wrist. Lenovo hasn't confirmed why, but The Verge suspects this could be critical to the phone being wearable by featuring a magnet for a secure hold. Videos Motorola shared with its press release today also show the user wearing some sort of metal-looking band on their wrist that the smartphone wraps around. And images of the device show a metal-looking strip that might be for connecting to the additional band in question.

According to Motorola's press release, the concept device has "FHD+" resolution across the display, which has a 6.9-inch diagonal size when flat. Also when flat, the device runs the "full Android experience, just like any smartphone," according to Motorola. The concept shown this week differs slightly from the concept demoed at Lenovo Tech World '16 in that it can be arched or bent into an upright position. [...] But beyond that, Motorola doesn't seem any closer to releasing the design.

Next year Intel introduces a new transistor — RibbonFET — and a new way of powering it called "PowerVia."

This so-called "backside power" approach "aims to separate power and I/O wiring, shifting power lines to the back of the wafer," reports Tom's Hardware, which "eliminates any possible interference between the data and power wires and increases logic transistor density." IEEE Spectrum explains this approach "leaves more room for the data interconnects above the silicon," while "the power interconnects can be made larger and therefore less resistive."

And Intel has already done some successful powering tests using it on Intel's current transistors: The resulting cores saw more than a 6 percent frequency boost as well as more compact designs and 30 percent less power loss. Just as important, the tests proved that including backside power doesn't make the chips more costly, less reliable, or more difficult to test for defects. Intel is presenting the details of these tests in Tokyo next week at the IEEE Symposium on VLSI Technology and Circuits...

[C]ores can be made more compact, decreasing the length of interconnects between logic cells, which speeds things up. When the standard logic cells that make up the processor core are laid out on the chip, interconnect congestion keeps them from packing together perfectly, leaving loads of blank space between the cells. With less congestion among the data interconnects, the cells fit together more tightly, with some portions up to 95 percent filled... What's more, the lack of congestion allowed some of the smallest interconnects to spread out a bit, reducing parasitic capacitance that hinders performance...

With the process for PowerVia worked out, the only change Intel will have to make in order to complete its move from Intel 4 to the next node, called 20A, is to the transistor... Success would put Intel ahead of TSMC and Samsung, in offering both nanosheet transistors and backside power.

ASUS is extending its connector-less design to graphics cards and has showcased the first GPU, a GeForce RTX 40 design, which features now power plugs. From a report: Spotted during our tour at the ASUS HQ, the ROG team gave us a first look at an upcoming graphics card (currently still in the concept phase) which is part of its GeForce RTX 40 family. The graphics card itself was a GeForce RTX 4070 design but it doesn't fall under any existing VGA product lineup & comes in an interesting design.

So the graphics card itself is a 2.3 slot design that features a triple axial-tech cooling fan system and once again, it isn't part of any interesting GPU lineup from ASUS such as ROG STRIX, TUF Gaming, Dual, etc. The backside of the card features an extended backplate that extends beyond the PCB & there's a cut-out for the air to pass through. The card also comes with a dual-BIOS switch that lets you switch between the "Performance" & "Quiet" modes but while there's a "Megalodon" naming on the backplate, we were told that isn't the final branding for this card.

Intel has completed development of its Intel 18A (1.8nm-class) and Intel 20A (2nm-class) fabrication processes that will be used to make the company's own products, as well as chips for clients of its Intel Foundry Services (IFS) division, reports UDN. From a report: Wang Rui, president and chairman of Intel China, said at an event that the company had finalized the development of its Intel 18A (18 angstroms-class) and Intel 20A (20 angstroms-class) fabrication processes. This does not mean that the production nodes are ready to be used for commercial manufacturing, but rather that Intel has determined all specifications, materials, requirements, and performance targets for both technologies.

Intel's 20A fabrication technology will rely on gate-all-around RibbonFET transistors and will use backside power delivery. Shrinking metal pitches, introducing all-new transistor structure and adding backside power delivery at the same time is a risky move, but it is expected that 20A will allow Intel to leapfrog the company's competitors -- TSMC and Samsung Foundry. Intel plans to start using this node in the first half of 2024. Intel's 18A manufacturing process will further refine the company's RibbonFET and PowerVia technologies, as well as shrink transistor sizes. Development of this node is apparently going so well that Intel pulled in its introduction from 2025 to the second half of 2024. Intel originally planned to use ASML's Twinscan EXE scanners with a 0.55 numerical aperture (NA) optics for its 1.8 angstroms node, but because it decided to start using the technology sooner, it will have to rely on extensive use of existing Twinscan NXE scanners with 0.33 NA optics, as well as EUV double patterning.

Taiwan Semiconductor Manufacturing Co. today officially introduced its N2 (2nm class) manufacturing technology, its first node that will use gate-all-around field-effect transistors (GAAFETs), at its 2022 TSMC Technology Symposium. From a report: The new fabrication process will offer a full-now performance and power benefits, but when it comes to transistor density, it will barely impress in 2025 when it comes online. Being an all-new process technology platform, TSMC's N2 brings in two essential innovations: nanosheet transistors (which is what TSMC calls its GAAFETs) and backside power rail that both serve the same goal of increasing performance-per-watt characteristics of the node. GAA nanosheet transistors feature channels surrounded by gates on all four sides, which reduces leakage; furthermore, their channels can be widened to increase drive current and boost performance or shrunken to minimize power consumption and cost. To feed these nanosheet transistors with enough power and now waste any of it, TSMC's N2 uses backside power delivery, which the foundry considers to be among the best solutions to fight resistances in the back-end-of-line (BEOL).

Indeed, when it comes to performance and power consumption, TSMC's nanosheet-based N2 node can boast of a 10% to 15% higher performance at the same power and complexity as well as a 25% to 30% lower power consumption at the same frequency and transistor count when compared to TSMC's N3E. However, the new node increases chip density by only around 1.1X compared to N3E. In general, TSMC's N3 does offer full-node performance increases and power consumption reductions. But density-wise, the new technology can hardly impress. For example, TSMC's N3E node offers a 1.3X chip density increase over N5, which is a substantial increase.

Facebook parent company Meta Platforms has halted development of a smartwatch with dual cameras and is instead working on other devices for the wrist, Bloomberg reported Wednesday, citing a person with knowledge of the matter. From the report: The device, which has been in development for at least two years, was designed to include several features common in other smartwatches, including activity tracking, music playback and messaging. A prototype of the now halted device includes dual-cameras, a key differentiator from market leaders like the Apple Watch. One camera was located below the display and another sat on the backside against the wearer's wrist, according to images and video of a prototype seen by Bloomberg. The second camera was designed so users could remove the watch face from its strap to quickly take pictures. But the presence of the camera caused issues with another feature for translating nerve signals from the wrist into digital commands, the person said. Having that technical ability, known as electromyography, is a top priority for Meta.

Lamborghini's exotic Countach sportscar was featured in the opening scene of the 1981 movie Cannonball Run. On the car's 50th anniversary, they've now introduced a 802-horsepower hybrid-electric version. Mashable reports: The reimagined Countach, unveiled in Monterey, California on Friday, is the Italian carmaker's second hybrid. Its drivetrain and performance borrows heavily from the Sián supercar, which was introduced in 2019 as the famous sports car maker's first hybrid. Lamborghini's new Countach (pronounced "coon-tash") has a V12 hybrid engine and 48 volt e-motor, as also seen in the Sián. It can accelerate up to 60 mph in 2.8 seconds and has a 220 mph top speed. Unlike some hybrids, the Countach doesn't have a pure electric mode. Instead, it's always using a blend of the electric motor and gas engine.

The air vents on the back are 3D-printed and the roof is photochromic, meaning it switches from solid to transparent at the push of a button. There are also four exhaust pipes on the backside...

There will only be 112 of Lamborghini's new hybrid Countach ever made...
TechCrunch adds that "Powering the Countach's electric motor is a supercapacitor Lamborghini claims delivers three times more power compared to a lithium-ion battery of the same weight.

"The automaker says it mounted the electric motor directly to the gearbox to preserve the feeling of power transfer you get from a V12 engine."

The Fairphone 3+ is a $550 phone with modular parts that can easily be swapped out by users themselves. "In many ways, a Fairphone is the antithesis of the iPhone," writes Catie Keck via Gizmodo. "It doesn't benefit most retailers to allow you to easily repair your own stuff, meaning that a lot of gizmos these days -- particularly higher-end electronics -- are packed with proprietary parts and sometimes even software locks to dissuade consumers from attempting to perform repairs themselves." While it is a "repairable dream" and features two big camera upgrades over the Fairphone 3 (which does support the new upgraded camera modules), it's, sadly, only available overseas. Keck writes: Fairphone 3+ has 64GB of memory but can be upgraded to 400GB with a MicroSD card. It has a Qualcomm 632 processor, a 5.65-inch display, Bluetooth 5, a 3000mAh battery that supports Qualcomm QuickCharge, and six total modules to swap out for easy repair. A thing I didn't expect to love as much as I did was fingerprint ID on the backside of the phone -- particularly as Face ID on my iPhone 11 has become a massive pain in the butt in these mask-on times. At present, Fairphone doesn't support 4G connectivity in the U.S., my biggest gripe with the phone second only to the fact that the phones only ship within Europe. [...] Fairphone runs on Android -- the Fairphone 3+ comes with Android 10 pre-installed and ready to go.

As for its camera, I was happy enough with the photograph with the newer lens. Photo nerds may be more sensitive to the trade-offs when compared with, say, the iPhone 11 Pro, but for the average person, I think Fairphone's cameras would work beautifully. I especially loved the portrait mode on the front camera, which worked in even exceptionally low-light environments for me. Software likely isn't the primary reason that anyone is looking at getting a Fairphone device, but shipping pre-installed with a lot of familiar apps means making the switch will likely be relatively painless, though so far my iPhone is a bit snappier overall in terms of performance. Again, the tradeoff is a commitment to repairability that you simply won't get with an Apple device unless the company radically overhauls its entire business model or unless it's forced, neither of which seems remotely likely for the foreseeable future.

The new OnePlus 7T was officially announced earlier today, bringing a speedier Snapdragon 855+ processor, 90Hz display, and more camera sensors for $599 -- nearly $100 less than the base model OnePlus 7 Pro. From a report: There are more upgrades found in the OnePlus 7T's display. The OP7T's 6.55-inch 2400x1080 AMOLED screen includes a 90Hz refresh rate, helping to make the screen feel smoother, and OnePlus has also upgraded the in-display fingerprint sensor on its new device. OnePlus claims that the OP7T has the "fastest, smoothest fingerprint unlock anywhere." Another major upgrade of the OnePlus 7T is on its backside. OnePlus has given the 7T a triple rear camera setup, up from the dual cameras found on the OnePlus 7. The triple rear cam system on the OnePlus 7T includes a 48MP main sensor with f/1.6 aperture and OIS, a 16MP ultra-wide camera with a 117-degree field of view, and a 12MP telephoto camera with a 2x optical zoom.

OnePlus has included ultra-wide Nightscape support for low-light shooting and Super Stable Video to better stabilize your video captures, and 4K video capture at 60fps. Slow-mo video recording is available at 1080p at 240fps or 720p at 480fps, and soon OnePlus will be slowing things down even more, adding 720p video recording at 960fps through a future software update. Around front there's a 16MP selfie camera in a waterdrop notch that OnePlus says is smaller than the notch found on last year's OnePlus 6T. OnePlus has packed the OP7T with 128GB of built-in UFS 3.0 storage, 8GB of RAM, USB-C, stereo speakers, Bluetooth 5.0, NFC, and Android 10 running out of the box. The OnePlus 7T launches on October 18 at a price of $599. The device will be sold exclusively by T-Mobile, though Verizon and AT&T users can buy an unlocked version from OnePlus' website.

According to an iFixit teardown, Apple's new 4K 21.5-inch iMac has both removable RAM and a Kaby Lake processor that's not soldered onto the logic board. Whereas the previous models had soldered memory modules, the new iMac's memory sit in two removable SO-DIMM slots. MacRumors reports: iFixit made the discovery by disassembling Apple's $1,299 mid-range 3.0GHz stock option, which includes 8GB of 2400MHz DDR4 memory, a Radeon Pro 555 graphics card with 2GB of VRAM, and a 1TB 5400-RPM hard drive. After slicing through the adhesive that secures the 4K display to the iMac's housing and removing the power supply, hard drive, and fan, iFixit discovered that the memory modules aren't soldered onto the logic board like previous models, but instead sit in two removable SO-DIMM slots. Similarly, after detaching the heatsink and removing the warranty voiding stickers on the backside of the logic board, iFixit found that the Intel SR32W Core i5-7400 Kaby Lake processor sits in a standard LGA 1151 CPU socket, making it possible to replace or upgrade the CPU without a reflow station.

The size of each passenger's seat on an airplane -- as well as the distance between rows of seats -- should be standardized, according to legislation proposed by two American lawmakers. Slashdot reader AmiMoJo quotes Consumerist: The text of the bill does not specify any dimensions for seat widths or legroom. Rather, if the legislation is passed, the particulars would be left up to the FAA to sort out... Though seat size may vary from airline to airline, Cohen notes that the average distance between rows of seats has dropped from 35 inches before airline deregulation in the 1970s, to around 31 inches today. Your backside is getting the squeeze, as well, as the average width of an airline seat has also shrunk from 18 inches to about 16.5 inches.

MojoKid writes "Historically, all-in-one desktop systems like the iMac, HP's TouchSmart and similar designs that incorporate a full system on the backside of a monitor, haven't offered performance that was competitive to their full-sized desktop counterparts. Part of the reason is that many of these systems are comprised of low power notebook platform PC components inside thin chassis designs with minimal airflow. However, as mobile platforms have become more powerful, so has the all-in-one PC. Dell's recently launched XPS 27 Touch, with Intel's Haswell mobile processor and an NVIDIA GeForce GT 750M on board, is an example of a new breed of AIO hitting the market now. The system is based on a 27-inch panel with 2TB of storage, a 32GB SSD cache drive, 8GB of RAM and performance in the benchmarks that keeps pace with average midrange full-sized desktops. You can even game on the machine with frame rates at the panel's 1080p native resolution with medium to high image quality. It's almost like the all-in-one finally grew up."

An anonymous reader writes "The BBC reports on a new study of prehistoric skulls which suggests that Neanderthals became extinct because they had larger eyes than our species. As a consequence of having extra sized eyes, an average 6 millimeters larger in radius, more of their backside brain volume was devoted to seeing, at the expense of frontal lobe high-level processing of information and emotions. This difference affected their ability to innovate and socialize the way we, modern people (Homo Sapiens Sapiens) do. When the last Ice Age set on 28,000 years ago, Neanderthals had no sewn clothes and no large organized groups to rely on each other, hastening their fall. Yet, they were not stupid, brutish creatures as portrayed in Hollywood films, they were very, very smart, but not quite in the same league as the Homo Sapiens of Cromagnon."

MrSeb writes "Logitech has released its first washable keyboard. We're not just talking about 'splash proof' either — you can take the K310, immerse it in up to 30cm of water (12in), and give it a good scrub. The only limitation is you can only use standard washing up liquid — oh, and Logitech says you should try to keep the USB connector out of the water, too. Once you've washed the keyboard, simply leave it to dry. The user guide says it takes eight hours to air dry, and that you shouldn't use a hair dryer. There are actually drainage holes on the backside of the K310, to help speed things along. This isn't the first washable keyboard — HP and Kensington have both had models on the market for a while — but the K310 does seem to be the first reasonably attractive, consumer-oriented washable keyboard. It goes on sale at the end of the month for $40."

jawtheshark writes "I'm building a house, and obviously I want a modest network built-in. Nothing fancy, two RJ-45 per room, four in the living room, and that's basically it. I already got myself a rack mountable Cisco Small Business switch and I have a self-built 4U server (low-power, won't make much heat) which can be rack mounted (505mm deep). Now, the construction company suggests a wall mounted rack (6U: 340mm x 600mm x 480mm — 6U definitely won't be enough, but a 12U model exists). It's not expensive, but I have never worked on a rack where the backside is unreachable. (For work, I get to work in a data center with huge racks that are accessible from both sides). Now obviously, I don't need a data center-grade rack, but these wall-mounted racks scream 'switch-only' racks to me. What are your experiences? Is it possible to put servers in racks like these, or should I find a 'both-side-accessible' rack instead?"