Micron And Intel Announce 3D NAND Flash Co-Development To Push SSDs Past 10TB

MojoKid writes: Both Micron and Intel noted in a release today that traditional planar NAND flash memory is reaching a dead-end, and as such, have been working together on 3D memory technology that could open the floodgates for high densities and faster speeds. Not all 3D memory is alike, however. This joint development effort resulted in a "floating gate cell" being used, something not uncommon for standard flash, but a first for 3D. Ultimately, this 3D NAND is composed of flash cells stacked 32 high, resulting in 256Gb MLC and 384Gb TLC die that fit inside of a standard package. That gives us 48GB per die, and up to 750GB in a single package. Other benefits include faster performance, reduced cost, and technologies that help extend the life of the memory.