The world's tallest chip defies the limits of computing: goodbye to Moore's Law?

dbialac writes: Building chips up instead of smaller may be a solution to the problems encountered with modern semiconductors.

Xiaohang Li, a researcher at King Abdullah University of Science and Technology (KAUST) in Saudi Arabia, and his team have designed a chip with 41 vertical layers of semiconductors and insulating materials, approximately ten times higher than any previously manufactured chip. The work, recently published in the journal Nature Electronics, not only represents a technical milestone but also opens the door to a new generation of flexible, efficient, and sustainable electronic devices. “Having six or more layers of transistors stacked vertically allows us to increase circuit density without making the devices smaller laterally,” Li explains. “With six layers, we can integrate 600% more logic functions in the same area than with a single layer, achieving higher performance and lower power consumption.”