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Average Ratings 0 Ratings

Total
ease
features
design
support

No User Reviews. Be the first to provide a review:

Write a Review

Description

Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.

Description

Creating designs at advanced process nodes necessitates a novel approach to place-and-route to handle the growing intricacies involved. Aprisa stands out as a detail-route-focused physical design platform tailored for contemporary SoCs. Operating as a complete RTL2GDSII solution, Aprisa facilitates digital implementation by providing comprehensive synthesis and place-and-route capabilities for both top-level hierarchical designs and block-level executions. Its alignment with signoff tools for STA timing and DRC offers tape-out quality correlation, which minimizes design closure challenges while ensuring peak performance, power efficiency, and area optimization (PPA). With its out-of-the-box performance, Aprisa enables physical designers to streamline each phase of the place-and-route process, accelerating their time-to-market. The unified architecture and shared analysis engines within Aprisa guarantee outstanding timing and DRC correlation throughout implementation stages and with signoff tools, significantly cutting down on the required flow iterations and engineering change orders (ECOs). As a result, this innovative approach ultimately enhances both productivity and design quality in complex projects.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Ansys

Country

United States

Website

www.ansys.com/products/electronics/ansys-icepak

Vendor Details

Company Name

Siemens

Founded

1847

Country

United States

Website

eda.sw.siemens.com/en-US/ic/aprisa/

Product Features

Product Features

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