Ansys Icepak Description
Ansys Icepak solves thermal management problems using CFD. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak offers powerful electronic cooling solutions using the industry-leading Ansys Fluent CFD solver to perform thermal and fluid flow analysis of integrated circuits, packages, printed circuit board (PCBs), electronic assemblies and enclosures. Ansys' Icepak CFD solution uses the Ansys Electronics Desktop GUI (GUI). Perform heat transfer analysis conjugated with conduction, convection and radiation. Advanced capabilities include laminar and turbulent flow modeling, species analysis, including radiation and convection. Ansys PCB Design Solution allows you to simulate PCBs and ICs and accurately evaluate a system.
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