Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
Description
Ansys VeloceRF accelerates the design process by significantly cutting down the time required to synthesize and model intricate spiral devices and transmission lines. Compiling the geometry of inductors or transformers takes just a matter of seconds, while modeling and analyzing them can be completed in just a few minutes. This software seamlessly integrates with top EDA platforms, creating layouts that are ready for tape-out. With Ansys VeloceRF, users can synthesize devices that tightly pack multiple components and lines, resulting in a more efficient silicon floorplan. Furthermore, analyzing the coupling effects among various inductive devices prior to detailed layout can decrease the overall design size and potentially eliminate the need for guard rings. The dimensions of inductors, along with crosstalk between them, can significantly influence the size of the die. Ansys VeloceRF assists in designing smaller devices by applying optimization criteria and geometry constraints, leading to enhanced performance. Additionally, it assesses the coupling between any number of inductors, optimizing both silicon area and inductor performance within the circuit context, ultimately contributing to a more efficient design process. By streamlining these aspects, Ansys VeloceRF empowers engineers to achieve their design goals more effectively.
API Access
Has API
No
API Access
Has API
No
Integrations
Ansys Electronics Desktop (AEDT)
No
Ansys Fluent
No
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
Yes
Chromebook
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
Yes
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
Yes
In Person
No
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Vendor Details
Company Name
Ansys
Founded
1970
Country
United States
Website
www.ansys.com/products/semiconductors/ansys-velocerf
Product Features
PCB Design
3D Visualization
No
Autorouting
No
Collaboration Tools
No
Component Library
No
Design Rule Check
No
Differential Pair Routing
No
Schematic Editor
No