Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
The Ansys HPC software suite allows users to leverage modern multicore processors to conduct a greater number of simulations in a shorter timeframe. These simulations can achieve unprecedented levels of complexity, size, and accuracy thanks to high-performance computing (HPC) capabilities. Ansys provides a range of HPC licensing options that enable scalability, accommodating everything from single-user setups for basic parallel processing to extensive configurations that support nearly limitless parallel processing power. For larger teams, Ansys ensures the ability to execute highly scalable, multiple parallel processing simulations to tackle the most demanding projects. In addition to its parallel computing capabilities, Ansys also delivers parametric computing solutions, allowing for a deeper exploration of various design parameters—including dimensions, weight, shape, materials, and mechanical properties—during the early stages of product development. This comprehensive approach not only enhances simulation efficiency but also significantly optimizes the design process.
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
API Access
Has API
API Access
Has API
Integrations
Ansys Electronics Desktop (AEDT)
Ansys Fluent
Pricing Details
No price information available.
Free Trial
Free Version
Pricing Details
No price information available.
Free Trial
Free Version
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/it-solutions/hpc
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak