Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
The Ansys Additive Suite provides essential insights that help designers, engineers, and analysts prevent build failures while ensuring that parts meet precise design specifications. This all-encompassing solution covers the full spectrum of the workflow, which includes design for additive manufacturing (DfAM), validation, print design, process simulation, and material exploration. Within the Additive Suite, users have access to tools such as Additive Prep, Print, and Science, along with Ansys Workbench Additive. Many features in Ansys Workbench allow for the creation of parametric analysis systems, enabling the examination and optimization of various parameters like part orientation and positioning. This suite is offered as an additional module for those holding an Ansys Mechanical Enterprise license. The integration of these tools facilitates a more streamlined approach to additive manufacturing, enhancing the overall efficiency and reliability of the production process.
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
API Access
Has API
No
API Access
Has API
No
Integrations
Ansys Electronics Desktop (AEDT)
No
Ansys Fluent
No
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
Yes
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
No
Live Training (Online)
Yes
In Person
No
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Vendor Details
Company Name
Ansys
Founded
1970
Country
United States
Website
www.ansys.com/products/structures/ansys-additive-suite
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Product Features
3D Printing
Analytics
No
Customizable Support Structures
No
ERP
No
Integrates with CAD
No
Mesh Analysis and Repair
No
Model Setup and Plating
No
Multi-User Support and Permissions
No
Multiple/Shared Print Queues
No
Pre-Print Simulations
No
Print File Creation
No
Slicing
No
Simulation
1D Simulation
No
3D Modeling
No
3D Simulation
No
Agent-Based Modeling
No
Continuous Modeling
No
Design Analysis
No
Direct Manipulation
No
Discrete Event Modeling
No
Dynamic Modeling
No
Graphical Modeling
No
Industry Specific Database
No
Monte Carlo Simulation
No
Motion Modeling
No
Presentation Tools
No
Stochastic Modeling
No
Turbulence Modeling
No