Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
The Ansys Additive Suite provides essential insights that help designers, engineers, and analysts prevent build failures while ensuring that parts meet precise design specifications. This all-encompassing solution covers the full spectrum of the workflow, which includes design for additive manufacturing (DfAM), validation, print design, process simulation, and material exploration. Within the Additive Suite, users have access to tools such as Additive Prep, Print, and Science, along with Ansys Workbench Additive. Many features in Ansys Workbench allow for the creation of parametric analysis systems, enabling the examination and optimization of various parameters like part orientation and positioning. This suite is offered as an additional module for those holding an Ansys Mechanical Enterprise license. The integration of these tools facilitates a more streamlined approach to additive manufacturing, enhancing the overall efficiency and reliability of the production process.
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
API Access
Has API
API Access
Has API
Integrations
Ansys Electronics Desktop (AEDT)
Ansys Fluent
Pricing Details
No price information available.
Free Trial
Free Version
Pricing Details
No price information available.
Free Trial
Free Version
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Vendor Details
Company Name
Ansys
Founded
1970
Country
United States
Website
www.ansys.com/products/structures/ansys-additive-suite
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Product Features
3D Printing
Analytics
Customizable Support Structures
ERP
Integrates with CAD
Mesh Analysis and Repair
Model Setup and Plating
Multi-User Support and Permissions
Multiple/Shared Print Queues
Pre-Print Simulations
Print File Creation
Slicing
Simulation
1D Simulation
3D Modeling
3D Simulation
Agent-Based Modeling
Continuous Modeling
Design Analysis
Direct Manipulation
Discrete Event Modeling
Dynamic Modeling
Graphical Modeling
Industry Specific Database
Monte Carlo Simulation
Motion Modeling
Presentation Tools
Stochastic Modeling
Turbulence Modeling