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Average Ratings 0 Ratings

Total
ease
features
design
support

No User Reviews. Be the first to provide a review:

Write a Review

Description

The Synopsys 3DIC Compiler, which is founded on the premier digital implementation platform in the industry and leverages a unified fusion data model, facilitates a smooth transition to 2.5/3D heterogeneous integration. This comprehensive platform supports analysis-driven feasibility studies, multi-die partitioning, and the selection of foundry technology for both prototyping and floor planning in a single environment. As a result, it promotes effective design implementation that encompasses advanced packaging and die-to-die routing, coupled with golden signoff verification. Additionally, the 3DIC Compiler collaborates with Synopsys 3DSO.ai, the first autonomous AI optimization solution in the market for multi-die designs, enhancing system performance and ensuring quality outcomes regarding thermal integrity, signal integrity, and power network design. Widely embraced by clients, the 3DIC Compiler platform has also received certification from prominent foundries, validating its capabilities in advanced process and packaging technologies. This combination of features positions the 3DIC Compiler as a vital tool for engineers aiming to innovate in the realm of integrated circuit design.

Description

Cadence Celsius PowerDC technology offers efficient DC analysis to ensure reliable power delivery. This includes electrical/thermal simulations for maximum accuracy. The Celsius PowerDC technology quickly identifies areas of excessive IR drop and thermal hotspots to minimize the risk of failure of your design. Highly accurate, even with complex designs that have multiple voltage domains, complex plane structures and multiple voltage domains, providing conclusive IR analysis for board and package. DC simulations can be automatically set up using PowerTree Technology (source/sink defintions) captured during the schematic stage of design. Support for multi-structures, including stacked boards, multiple die, and all popular packaging types.

API Access

Has API No 

API Access

Has API No 

Screenshots View All

Screenshots View All

Integrations

AutoCAD No 
CryptoTax360° No 
Sigrity X Platform No 

Integrations

AutoCAD Yes 
CryptoTax360° Yes 
Sigrity X Platform Yes 

Pricing Details

No price information available.
Free Trial Yes 
Free Version No 

Pricing Details

No price information available.
Free Trial No 
Free Version No 

Deployment

Web-Based No 
On-Premises No 
iPhone App No 
iPad App No 
Android App No 
Windows Yes 
Mac No 
Linux No 
Chromebook No 

Deployment

Web-Based Yes 
On-Premises No 
iPhone App No 
iPad App No 
Android App No 
Windows No 
Mac No 
Linux No 
Chromebook No 

Customer Support

Business Hours Yes 
Live Rep (24/7) No 
Online Support Yes 

Customer Support

Business Hours No 
Live Rep (24/7) Yes 
Online Support Yes 

Types of Training

Training Docs Yes 
Webinars Yes 
Live Training (Online) Yes 
In Person Yes 

Types of Training

Training Docs Yes 
Webinars No 
Live Training (Online) Yes 
In Person No 

Vendor Details

Company Name

Synopsys

Founded

1986

Country

United States

Website

www.synopsys.com/implementation-and-signoff/3dic-design.html

Vendor Details

Company Name

Cadence Design Systems

Founded

1988

Country

United States

Website

www.cadence.com

Product Features

Product Features

PCB Design

3D Visualization No 
Autorouting No 
Collaboration Tools No 
Component Library No 
Design Rule Check No 
Differential Pair Routing No 
Schematic Editor No 

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