Want to read Slashdot from your mobile device? Point it at m.slashdot.org and keep reading!


Forgot your password?
Slashdot Deals: Cyber Monday Sale! Courses ranging from coding to project management - all eLearning deals 25% off with coupon code "CYBERMONDAY25". ×

Comment Re:In other Breaking News... (Score 1) 159

If someone found an On Star exploit that allowed a hacker to remotely accomplish these things on the CAN bus, then it would be news, this is not.

From the article: The researchers were able to control everything from the car’s brakes to its door locks to its computerized dashboard displays by accessing the onboard computer through GM’s OnStar and Ford’s Sync, as well as through the Bluetooth connections intended for making hands-free phone calls.

Data Storage

Samsung '3D' Memory Coming, 50% Denser 87

CWmike writes "Samsung on Tuesday announced a new 8GB dual inline memory module (DIMM) that stacks memory chips on top of each other, which increases the density of the memory by 50% compared with conventional DIMM technology. Samsung's new registered or buffered (RDIMM) product is based on its current Green DDR3 DRAM and 40 nanometer (nm)-sized circuitry. The new memory module is aimed at the server and enterprise storage markets. The three-dimensional (3D) chip stacking process is referred to in the memory industry as Through Silicon Via (TSV). Samsung said the TSV process saves up to 40% of the power consumed by a conventional RDIMM. Using the TSV technology will greatly improve chip density in next-generation server systems, Samsung said, making it attractive for high-density, high-performance systems."

"Today's robots are very primitive, capable of understanding only a few simple instructions such as 'go left', 'go right', and 'build car'." --John Sladek