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Comment: Re:In other Breaking News... (Score 1) 159

by GeoBain (#45277929) Attached to: Car Hackers Mess With Speedometers, Odometers, Alarms and Locks

If someone found an On Star exploit that allowed a hacker to remotely accomplish these things on the CAN bus, then it would be news, this is not.

From the article: The researchers were able to control everything from the car’s brakes to its door locks to its computerized dashboard displays by accessing the onboard computer through GM’s OnStar and Ford’s Sync, as well as through the Bluetooth connections intended for making hands-free phone calls.

Comment: Re:Cyanogen Mod. (Score 1) 111

by GeoBain (#42993275) Attached to: FTC to HTC: Patch Vulnerabilities On Smartphones and Tablets

they are very shoddily made and usually about 3 months into it 40-60% of the phones crap out multiple times and we have to end up giving out Samsung as replacements.

Sure am glad I am in the other 40-60%. Both my and my son's Droid Incredibles are still going strong after almost 3 years. (32 months)

Data Storage

Samsung '3D' Memory Coming, 50% Denser 87

Posted by timothy
from the now-in-stereo dept.
CWmike writes "Samsung on Tuesday announced a new 8GB dual inline memory module (DIMM) that stacks memory chips on top of each other, which increases the density of the memory by 50% compared with conventional DIMM technology. Samsung's new registered or buffered (RDIMM) product is based on its current Green DDR3 DRAM and 40 nanometer (nm)-sized circuitry. The new memory module is aimed at the server and enterprise storage markets. The three-dimensional (3D) chip stacking process is referred to in the memory industry as Through Silicon Via (TSV). Samsung said the TSV process saves up to 40% of the power consumed by a conventional RDIMM. Using the TSV technology will greatly improve chip density in next-generation server systems, Samsung said, making it attractive for high-density, high-performance systems."

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