Comment Re:RFI? Electromigration? (Score 1) 112

by ssista537 on Saturday January 27, 2007 @04:51PM (#17785286) Attached to: Intel, IBM Announce Chip Breakthrough

One reason why the industry moved to Cu interconnects as compared to Al is due to lower electromigration. Due to the specific microstructure in Cu and also due to its low bulk diffusion it is much more resistant to Electromigration. Having said that as the nodes start shrinking this might become a problem in the future........ May not be at the 45 nm node though.

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