Comment You don't know Flash (Score 1) 149
Quality control is very important to anyone who wants repeat business. Any modern 300mm flash fab worth's is silicon will perform at least the following tests.
1. Wafer level tests inline between mask steps
2. Wafer level tests after completed processing. Chips are usually either changed into MLC or SLC at this step. If any repairs are needed they are completed here (by using built in redundancy).
3. Select wafers are sent on for additional testing to verify cycling and to monitor for mean time between failure shifts.
4. After die are cut and packaged repeat tests above to ensure the packaging process didn't jack up the wafer.
The worst case scenario in all of this is to have a customer begin to complain about issues w/ your chips. That means your probe scheme either didn't catch the issue or the issue matters now because of another issue and their combined result means death.
After you have identified the issue then its long road to find that at your first implant level was jacked because a tech ignored a tool error on a batch of 125 wafers and sent them on w/o any documentation.