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Comment Re:So... (Score 1) 81

Stacking these things is all well and good, but at what point do heat considerations become a primary concern? Lately I haven't gotten the impression that volume of ICs is our biggest bottleneck.

Eventually the 'bricks' will end up with shapes that has the best heat transfer properties, e.g. a 'ring' shaped cpu dipped in cooling liquid.

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Is it possible that software is not like anything else, that it is meant to be discarded: that the whole point is to always see it as a soap bubble?

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