Speaking from personal experience in manufacturing, there are a lot of things that have to go right to get something like a die shrink to work.
Say you have a photoresist chemical that supports patterning a 10% smaller pattern. In the lithography step, you also need an exposure tool with good enough overlay to pattern these smaller layers on top of each other without too much of a shift. Then you need to develop the pattern and rinse away the exposed (or unexposed) photoresist, which you as a manufacturer may be on your own to figure out a process to do, and you need to do it with a new photoresist chemical and do it more cleanly than you did it before.
Now you need to get a more consistent etch depth, because with smaller features, they are probably thinner too.
Along with this, your deposition and polish tolerances need to be improved, and everything in your process needs to be cleaner because some foreign matter defects which may have been small enough to not matter before are big enough to matter now.
There are so many processes that all have to be improved on the manufacturing side for each technology node, that a huge step is technically infeasible. Even if you make a huge jump in the manufacturability of one process, you have several others that all need to catch up.