Re:Heat (Score 1)

There is a parallel advance in cooling technology using liquid based cooling. While this may not seem like a new idea to the /. crowd, integrated fluidic interconnects (analogous to optical or electrical interconnects), would allow a cooling liquid to be delivered to a chip. Researchers at Georgia Tech have demonstrated fluid flow through a chip: http://www.reed-electronics.com/semiconductor/arti cle/CA604509?pubdate=6%2F1%2F2005&industryid=3028 Connecting the chip to a printed wiring board with fluidic channels would allow an integrated heat removal system without significant need for additional pumping power (only a few atmospheres at low flowrates). Sounds like a pretty neat idea to me.