Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
Description
Ansys Sherlock stands out as the sole reliability physics-based tool for electronics design that delivers quick and precise life expectancy assessments for electronic components, boards, and systems during the initial design phases. By automating the design analysis process, Ansys Sherlock enables the rapid generation of life predictions, thus eliminating the "test-fail-fix-repeat" cycle that often hampers development. Designers can effectively model the interactions between silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies, allowing for accurate predictions of potential failure risks stemming from thermal, mechanical, and manufacturing stresses, all prior to creating prototypes. Additionally, Sherlock's extensive libraries, which house over 500,000 components, facilitate the seamless transformation of electronic computer-aided design (ECAD) files into computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each of these models is equipped with precise geometries and material properties, ensuring that stress information is accurately conveyed for reliable predictions. This capability not only enhances design efficiency but also significantly reduces the risk of costly errors in the later stages of product development.
API Access
Has API
No
API Access
Has API
Yes
Integrations
Ansys Electronics Desktop (AEDT)
No
Ansys Fluent
No
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
Yes
Chromebook
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
Yes
In Person
No
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Vendor Details
Company Name
Ansys
Founded
1970
Country
United States
Website
www.ansys.com/products/structures/ansys-sherlock
Product Features
Computer-Aided Engineering (CAE)
CAD/CAM Compatibility
No
Finite Element Analysis
No
Fluid Dynamics
No
Import / Export Files
No
Integrated 3D Modeling
No
Manufacturing Process Simulation
No
Mechanical Event Simulation
No
Multibody Dynamics
No
Thermal Analysis
No