Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Advanced systems featuring both rear and front I/O setups ensure exceptional performance. They incorporate blazing-fast storage solutions utilizing the latest PCIe 5.0 NVMe SSD technology. These systems provide networking versatility with support for AIOM NICs that comply with OCP 3.0 standards. Designed for peak performance and adaptability, they cater specifically to enterprise and telecom applications. Telco-optimized models boast short-depth, carrier-grade Hyper-E servers that meet NEBS Level 3 requirements. The innovative toolless design enhances serviceability, effectively reducing maintenance time. With an impressive capacity of up to 32 DIMM slots and a maximum memory of 8TB DDR5-4800, these systems also accommodate Intel® Optane™ persistent memory. They feature redundant power supplies rated at 2000W, 1300W, or 1200W with a Titanium efficiency level of 96%. Additionally, they support dual 4th Gen Intel® Xeon® Scalable processors with a TDP of up to 350W. Users can also utilize up to 24 hot-swap NVMe, SATA, or SAS drive bays, with optional RAID functionality available through AOC. This combination of features ensures that these systems are not only powerful but also incredibly versatile for a range of demanding applications.
Description
The 3U systems can accommodate 24, 12, or 8 nodes, featuring 4 DIMM slots each, with options for hot-swappable 3.5” or 2.5” NVMe/SAS3/SATA3 drives. Enhanced by onboard 10 Gigabit Ethernet, these systems are designed for optimal cost-effectiveness. The MicroCloud’s modular design ensures high density, ease of maintenance, and affordability, which are critical for modern hyper-scale operations. Integrated within a compact 3U chassis measuring under 30 inches in depth, these modular server nodes can save over 76% of rack space compared to conventional 1U servers. This family of MicroCloud servers specializes in single socket computing, optimized for hyper-scale data centers, utilizing the latest power-efficient and high-density system-on-chip (SoC) processors, including the Intel® Xeon® E/D/E3/E5 and Intel® Atom® C Processors, allowing for diverse and scalable cloud and edge computing solutions. Conveniently, power and I/O ports are positioned at the front of the chassis, facilitating quick server provisioning, upgrades, and maintenance tasks, enhancing operational efficiency further.
API Access
Has API
No
API Access
Has API
No
Integrations
GB Network Solutions
No
GPU.ai
No
RAVEL Orchestrate
No
Relianoid
No
TensorWave
No
Integrations
GB Network Solutions
Yes
GPU.ai
Yes
RAVEL Orchestrate
Yes
Relianoid
Yes
TensorWave
Yes
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
Yes
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
Yes
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Vendor Details
Company Name
Supermicro
Country
United States
Website
www.supermicro.com/en/products/hyper
Vendor Details
Company Name
Supermicro
Country
United States
Website
www.supermicro.com/en/products/microcloud