Supermicro MicroCloud Description
3U systems that support 24, 12, or 8 nodes with four DIMM slots. Hot-swappable 2.5" or 3.5" NVMe/SAS3/SATA3 options. Onboard 10 Gigabit Ethernet for optimized cost-effectiveness. MicroCloud modular architecture offers the high density, serviceability and cost-effectiveness required to meet today's hyper-scale deployment requirements. The 24/12/8 modular server nodes can be easily integrated into a compact 3U chassis, which is less than 30 inches in depth. This saves over 76% rack space compared to traditional 1U servers. The MicroCloud family provides hyperscale data center optimized single socket computing solutions using the latest low-power and high density system-on-chip processors (SoC), including Intel(r] Xeon®, E/D/E3/E5 or Intel(r] Atom®, C Processors. This allows for a wide variety of flexible and scalable cloud computing and edge computing solutions. The front of the chassis houses power and I/O ports for fast server provision, upgrades, service, and support.
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