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Average Ratings 0 Ratings

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ease
features
design
support

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Description

Advanced systems featuring both rear and front I/O setups ensure exceptional performance. They incorporate blazing-fast storage solutions utilizing the latest PCIe 5.0 NVMe SSD technology. These systems provide networking versatility with support for AIOM NICs that comply with OCP 3.0 standards. Designed for peak performance and adaptability, they cater specifically to enterprise and telecom applications. Telco-optimized models boast short-depth, carrier-grade Hyper-E servers that meet NEBS Level 3 requirements. The innovative toolless design enhances serviceability, effectively reducing maintenance time. With an impressive capacity of up to 32 DIMM slots and a maximum memory of 8TB DDR5-4800, these systems also accommodate Intel® Optane™ persistent memory. They feature redundant power supplies rated at 2000W, 1300W, or 1200W with a Titanium efficiency level of 96%. Additionally, they support dual 4th Gen Intel® Xeon® Scalable processors with a TDP of up to 350W. Users can also utilize up to 24 hot-swap NVMe, SATA, or SAS drive bays, with optional RAID functionality available through AOC. This combination of features ensures that these systems are not only powerful but also incredibly versatile for a range of demanding applications.

Description

The 3U systems can accommodate 24, 12, or 8 nodes, featuring 4 DIMM slots each, with options for hot-swappable 3.5” or 2.5” NVMe/SAS3/SATA3 drives. Enhanced by onboard 10 Gigabit Ethernet, these systems are designed for optimal cost-effectiveness. The MicroCloud’s modular design ensures high density, ease of maintenance, and affordability, which are critical for modern hyper-scale operations. Integrated within a compact 3U chassis measuring under 30 inches in depth, these modular server nodes can save over 76% of rack space compared to conventional 1U servers. This family of MicroCloud servers specializes in single socket computing, optimized for hyper-scale data centers, utilizing the latest power-efficient and high-density system-on-chip (SoC) processors, including the Intel® Xeon® E/D/E3/E5 and Intel® Atom® C Processors, allowing for diverse and scalable cloud and edge computing solutions. Conveniently, power and I/O ports are positioned at the front of the chassis, facilitating quick server provisioning, upgrades, and maintenance tasks, enhancing operational efficiency further.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

RAVEL Orchestrate
Relianoid

Integrations

RAVEL Orchestrate
Relianoid

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Supermicro

Country

United States

Website

www.supermicro.com/en/products/hyper

Vendor Details

Company Name

Supermicro

Country

United States

Website

www.supermicro.com/en/products/microcloud

Product Features

Product Features

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