Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
The Semi Process Lab serves as an online environment tailored for semiconductor and display engineers, enabling them to predict process outcomes effectively. Its suite of Design · Predict tools encompasses various modeling techniques for ALD, CVD, PECVD, PVD, RIE, and ALE, aimed at estimating critical parameters such as film growth, thickness, wafer uniformity, step coverage, and etch profiles. Users have the capability to analyze wafer maps and visualize complex structures in 3D, including trenches, vias, or stacked designs, while also exploring equipment configurations and device layouts. The platform encourages experimentation by providing model suggestions to fine-tune process parameters or develop new experimental protocols. Additionally, it facilitates the integration of measured equipment data for calibration purposes and includes a variety of design templates alongside AI-driven image generation. Users can conveniently export their findings in multiple formats, such as PPTX, Word, Excel, and PNG, and also access free calculators for film uniformity, ALD growth per cycle, etch selectivity, and step coverage. Ultimately, this web application presents prediction outcomes as process-design estimates, which users are advised to verify on their specific equipment to ensure accuracy. This comprehensive approach not only enhances the design process but also empowers engineers to optimize their workflows effectively.
Description
WindowsLDP, short for Load Distribution Program, serves as a quasi-static tool for the design and analysis of both external and internal spur and helical gear pairs. This software has been widely adopted by many consortium members as their primary resource for gear design and analysis. There are also modified versions of this program that facilitate surface wear and duty cycle evaluations. Utilizing computationally efficient and precise semi-analytical methods, WindowsLDP calculates the load distribution across multiple engaging teeth of gears. Based on this load distribution data, it assesses the loaded transmission error, along with root and contact stress distributions, mesh stiffness functions, and tooth forces, while also providing insights into other relevant design parameters such as lubricant film thickness and surface temperature. Users can select either SI or English units for their analyses, enhancing flexibility in application. Additionally, WindowsLDP supports multi-torque analyses and evaluations of manufacturing robustness, making it a comprehensive tool for gear design. The program's versatility allows engineers to tailor their analyses to specific project requirements effectively.
API Access
Has API
No
API Access
Has API
No
Integrations
No details available.
Integrations
No details available.
Pricing Details
Plans use credits. New accounts receive free signup credits; additional credits are available through subscriptions or credit packs.
Free Trial
No
Free Version
No
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
No
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
No
Live Rep (24/7)
No
Online Support
No
Types of Training
Training Docs
Yes
Webinars
No
Live Training (Online)
No
In Person
No
Types of Training
Training Docs
No
Webinars
No
Live Training (Online)
No
In Person
No
Vendor Details
Company Name
Quantum Materials
Country
South Korea
Website
semiprocesslab.com
Vendor Details
Company Name
The Ohio State University
Founded
1870
Website
gearlab.osu.edu/windowsldp
Product Features
Product Features
Computer-Aided Engineering (CAE)
CAD/CAM Compatibility
No
Finite Element Analysis
No
Fluid Dynamics
No
Import / Export Files
No
Integrated 3D Modeling
No
Manufacturing Process Simulation
No
Mechanical Event Simulation
No
Multibody Dynamics
No
Thermal Analysis
No