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Average Ratings 0 Ratings

Total
ease
features
design
support

No User Reviews. Be the first to provide a review:

Write a Review

Description

Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.

Description

Ansys LS-DYNA stands out as the leading explicit simulation software widely utilized for various applications, including drop testing, impact analysis, penetration scenarios, collisions, and ensuring occupant safety. Renowned as the most extensively used explicit simulation tool globally, Ansys LS-DYNA excels in modeling the behavior of materials subjected to brief yet intense loading conditions. Its comprehensive suite of elements, contact formulations, and material models enables the simulation of intricate models while allowing precise control over every aspect of the issue at hand. The software offers a broad range of analyses, boasting rapid and effective parallel processing capabilities. Engineers can investigate simulations that involve material failure, examining how such failures evolve through components or entire systems. Additionally, LS-DYNA adeptly manages models with numerous interacting parts or surfaces, ensuring that the interactions and load transfers between complex behaviors are accurately represented. This capability makes LS-DYNA an invaluable tool for engineers facing multifaceted simulation challenges.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent
Simcenter 3D

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent
Simcenter 3D

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Ansys

Country

United States

Website

www.ansys.com/products/electronics/ansys-icepak

Vendor Details

Company Name

Ansys

Founded

1970

Country

United States

Website

www.ansys.com/products/structures/ansys-ls-dyna

Product Features

Product Features

Computer-Aided Engineering (CAE)

CAD/CAM Compatibility
Finite Element Analysis
Fluid Dynamics
Import / Export Files
Integrated 3D Modeling
Manufacturing Process Simulation
Mechanical Event Simulation
Multibody Dynamics
Thermal Analysis

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