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Description

The Synopsys 3DIC Compiler, which is founded on the premier digital implementation platform in the industry and leverages a unified fusion data model, facilitates a smooth transition to 2.5/3D heterogeneous integration. This comprehensive platform supports analysis-driven feasibility studies, multi-die partitioning, and the selection of foundry technology for both prototyping and floor planning in a single environment. As a result, it promotes effective design implementation that encompasses advanced packaging and die-to-die routing, coupled with golden signoff verification. Additionally, the 3DIC Compiler collaborates with Synopsys 3DSO.ai, the first autonomous AI optimization solution in the market for multi-die designs, enhancing system performance and ensuring quality outcomes regarding thermal integrity, signal integrity, and power network design. Widely embraced by clients, the 3DIC Compiler platform has also received certification from prominent foundries, validating its capabilities in advanced process and packaging technologies. This combination of features positions the 3DIC Compiler as a vital tool for engineers aiming to innovate in the realm of integrated circuit design.

Description

In today's fast-paced business environment, companies encounter intricate design obstacles while managing limited budgets. eCADSTAR transcends being just a PCB layout tool, as it integrates simulation, 3D MCAD capabilities, and wire harness support, all harnessed through cutting-edge technology that offers enterprise-level performance at a budget-friendly price point. Its user-friendly interface makes eCADSTAR an attractive choice for designers of all levels. By utilizing eCADSTAR’s robust design features, teams can streamline and expedite the overall design workflow. The software includes a digitally connected library and intuitive schematic capture, allowing PCB layout engineers to focus more on innovation and less on tool manipulation. Among the various stages of the design process, developing a test plan can be particularly labor-intensive. Without proper upfront simulation, the validation phase can lead to significant time and financial expenditures, but eCADSTAR addresses this challenge with its advanced capabilities in Spice simulation and SI/PI analysis, resulting in reduced test cycle times and increased efficiency overall. Ultimately, eCADSTAR stands out as a powerful ally for engineers striving to navigate the complexities of modern design.

API Access

Has API No 

API Access

Has API No 

Screenshots View All

Screenshots View All

Integrations

Pulsonix No 

Integrations

Pulsonix Yes 

Pricing Details

No price information available.
Free Trial Yes 
Free Version No 

Pricing Details

$3,995 one-time payment
Free Trial No 
Free Version No 

Deployment

Web-Based No 
On-Premises No 
iPhone App No 
iPad App No 
Android App No 
Windows Yes 
Mac No 
Linux No 
Chromebook No 

Deployment

Web-Based Yes 
On-Premises No 
iPhone App No 
iPad App No 
Android App No 
Windows No 
Mac No 
Linux No 
Chromebook No 

Customer Support

Business Hours Yes 
Live Rep (24/7) No 
Online Support Yes 

Customer Support

Business Hours Yes 
Live Rep (24/7) Yes 
Online Support Yes 

Types of Training

Training Docs Yes 
Webinars Yes 
Live Training (Online) Yes 
In Person Yes 

Types of Training

Training Docs Yes 
Webinars Yes 
Live Training (Online) Yes 
In Person Yes 

Vendor Details

Company Name

Synopsys

Founded

1986

Country

United States

Website

www.synopsys.com/implementation-and-signoff/3dic-design.html

Vendor Details

Company Name

Zuken

Founded

1976

Country

Germany

Website

www.zuken.com/us/product/ecadstar/

Product Features

Product Features

PCB Design

3D Visualization No 
Autorouting No 
Collaboration Tools No 
Component Library No 
Design Rule Check No 
Differential Pair Routing No 
Schematic Editor No 

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