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Description
The Synopsys 3DIC Compiler, which is founded on the premier digital implementation platform in the industry and leverages a unified fusion data model, facilitates a smooth transition to 2.5/3D heterogeneous integration. This comprehensive platform supports analysis-driven feasibility studies, multi-die partitioning, and the selection of foundry technology for both prototyping and floor planning in a single environment. As a result, it promotes effective design implementation that encompasses advanced packaging and die-to-die routing, coupled with golden signoff verification. Additionally, the 3DIC Compiler collaborates with Synopsys 3DSO.ai, the first autonomous AI optimization solution in the market for multi-die designs, enhancing system performance and ensuring quality outcomes regarding thermal integrity, signal integrity, and power network design. Widely embraced by clients, the 3DIC Compiler platform has also received certification from prominent foundries, validating its capabilities in advanced process and packaging technologies. This combination of features positions the 3DIC Compiler as a vital tool for engineers aiming to innovate in the realm of integrated circuit design.
Description
In today's fast-paced business environment, companies encounter intricate design obstacles while managing limited budgets. eCADSTAR transcends being just a PCB layout tool, as it integrates simulation, 3D MCAD capabilities, and wire harness support, all harnessed through cutting-edge technology that offers enterprise-level performance at a budget-friendly price point. Its user-friendly interface makes eCADSTAR an attractive choice for designers of all levels. By utilizing eCADSTAR’s robust design features, teams can streamline and expedite the overall design workflow. The software includes a digitally connected library and intuitive schematic capture, allowing PCB layout engineers to focus more on innovation and less on tool manipulation. Among the various stages of the design process, developing a test plan can be particularly labor-intensive. Without proper upfront simulation, the validation phase can lead to significant time and financial expenditures, but eCADSTAR addresses this challenge with its advanced capabilities in Spice simulation and SI/PI analysis, resulting in reduced test cycle times and increased efficiency overall. Ultimately, eCADSTAR stands out as a powerful ally for engineers striving to navigate the complexities of modern design.
API Access
Has API
API Access
Has API
Integrations
Pulsonix
Pricing Details
No price information available.
Free Trial
Free Version
Pricing Details
$3,995 one-time payment
Free Trial
Free Version
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Vendor Details
Company Name
Synopsys
Founded
1986
Country
United States
Website
www.synopsys.com/implementation-and-signoff/3dic-design.html
Vendor Details
Company Name
Zuken
Founded
1976
Country
Germany
Website
www.zuken.com/us/product/ecadstar/
Product Features
Product Features
PCB Design
3D Visualization
Autorouting
Collaboration Tools
Component Library
Design Rule Check
Differential Pair Routing
Schematic Editor