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Average Ratings 0 Ratings
Description
The Synopsys 3DIC Compiler, which is founded on the premier digital implementation platform in the industry and leverages a unified fusion data model, facilitates a smooth transition to 2.5/3D heterogeneous integration. This comprehensive platform supports analysis-driven feasibility studies, multi-die partitioning, and the selection of foundry technology for both prototyping and floor planning in a single environment. As a result, it promotes effective design implementation that encompasses advanced packaging and die-to-die routing, coupled with golden signoff verification. Additionally, the 3DIC Compiler collaborates with Synopsys 3DSO.ai, the first autonomous AI optimization solution in the market for multi-die designs, enhancing system performance and ensuring quality outcomes regarding thermal integrity, signal integrity, and power network design. Widely embraced by clients, the 3DIC Compiler platform has also received certification from prominent foundries, validating its capabilities in advanced process and packaging technologies. This combination of features positions the 3DIC Compiler as a vital tool for engineers aiming to innovate in the realm of integrated circuit design.
Description
Ansys Totem-SC stands out as the established and reliable leader in the realm of power noise and reliability validation for both analog and mixed-signal designs, utilizing a cloud-native elastic compute framework. Recognized as the benchmark solution for voltage drop and electromigration multiphysics sign-off at the transistor level, Ansys Totem-SC has proven its effectiveness across numerous tapeouts, leveraging a cloud-based infrastructure to provide the necessary speed and capacity for comprehensive full-chip assessments. Its accuracy in signoff has been validated by all major foundries, supporting advanced finFET technologies down to 3nm. This platform excels in power noise and reliability analysis specifically for analog mixed-signal intellectual property and fully custom designs. Moreover, it generates IP models that facilitate SOC-level power integrity signoff in conjunction with RedHawk-SC and develops compact chip models for power delivery networks applicable at both chip and system levels. The solution is not only industry-proven but also certified by foundries, making it a highly regarded choice for analog and mixed-signal electromigration and IR analysis. With Ansys Totem-SC, designers can confidently ensure the integrity and reliability of their power delivery systems throughout the design process.
API Access
Has API
API Access
Has API
Integrations
No details available.
Integrations
No details available.
Pricing Details
No price information available.
Free Trial
Free Version
Pricing Details
No price information available.
Free Trial
Free Version
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Vendor Details
Company Name
Synopsys
Founded
1986
Country
United States
Website
www.synopsys.com/implementation-and-signoff/3dic-design.html
Vendor Details
Company Name
Ansys
Founded
1970
Country
United States
Website
www.ansys.com/products/semiconductors/ansys-totem
Product Features
Product Features
Simulation
1D Simulation
3D Modeling
3D Simulation
Agent-Based Modeling
Continuous Modeling
Design Analysis
Direct Manipulation
Discrete Event Modeling
Dynamic Modeling
Graphical Modeling
Industry Specific Database
Monte Carlo Simulation
Motion Modeling
Presentation Tools
Stochastic Modeling
Turbulence Modeling