Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
The Synopsys 3DIC Compiler, which is founded on the premier digital implementation platform in the industry and leverages a unified fusion data model, facilitates a smooth transition to 2.5/3D heterogeneous integration. This comprehensive platform supports analysis-driven feasibility studies, multi-die partitioning, and the selection of foundry technology for both prototyping and floor planning in a single environment. As a result, it promotes effective design implementation that encompasses advanced packaging and die-to-die routing, coupled with golden signoff verification. Additionally, the 3DIC Compiler collaborates with Synopsys 3DSO.ai, the first autonomous AI optimization solution in the market for multi-die designs, enhancing system performance and ensuring quality outcomes regarding thermal integrity, signal integrity, and power network design. Widely embraced by clients, the 3DIC Compiler platform has also received certification from prominent foundries, validating its capabilities in advanced process and packaging technologies. This combination of features positions the 3DIC Compiler as a vital tool for engineers aiming to innovate in the realm of integrated circuit design.
Description
Ansys RedHawk-SC stands as the industry's premier solution for voltage drop and electromigration multiphysics sign-off in digital designs, recognized for its reliability. Its advanced analytics swiftly uncover vulnerabilities and facilitate what-if scenarios to enhance both power efficiency and performance. The cloud-based framework of RedHawk-SC ensures it can efficiently manage full-chip analyses with remarkable speed and capacity. The signoff precision is validated by all leading foundries across all finFET nodes, including those down to 3nm. Through its sophisticated power analytics, Ansys RedHawk-SC supports the creation of robust, low-power digital designs without sacrificing performance, offering designers extensive methods to identify and rectify dynamic voltage drop issues. The trusted multiphysics signoff analysis provided by Ansys RedHawk-SC significantly mitigates project and technology risks. Additionally, its algorithms have been rigorously validated by major foundries for all finFET processes and have demonstrated success in countless tapeouts, further solidifying its reputation in the industry. As technology continues to evolve, the capabilities of Ansys RedHawk-SC will adapt to meet future challenges in digital design.
API Access
Has API
API Access
Has API
Integrations
AWS Marketplace
Pricing Details
No price information available.
Free Trial
Free Version
Pricing Details
No price information available.
Free Trial
Free Version
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Vendor Details
Company Name
Synopsys
Founded
1986
Country
United States
Website
www.synopsys.com/implementation-and-signoff/3dic-design.html
Vendor Details
Company Name
Ansys
Founded
1970
Country
United States
Website
www.ansys.com/products/semiconductors/ansys-redhawk-sc
Product Features
Product Features
Electrical Design
CAD Tools
Change Management
Collaboration
Compliance Management
Document Generation
Drag & Drop
Electrical Parts Catalog
Functions / Calculations
One Line Diagram
PLC Tools
Reusable Designs
Symbol Library
PCB Design
3D Visualization
Autorouting
Collaboration Tools
Component Library
Design Rule Check
Differential Pair Routing
Schematic Editor