Come on little gamma ray
Standin' in a hurricane

https://www.youtube.com/watch?v=Z25_T_wkAV4

They use electron radiation. The radiation creates defects in the crystal lattice. Those defects act as recombination centers for holes and electrons. The increased recombination rate correspondingly increases the gain of bipolar transistors.

Like Tim the Gecko said, we're talking about carrier lifetime (Tau), not device lifetime.

Our foundry uses 200 mm wafers. I think the cost is around $20 per wafer. I don't know, because the substrates are so cheap, they don't even charge us. Epi is a little more expensive because of the extra processing -- maybe $50.

I imagine the cost scales with wafer diameter. 200 mm is relatively old technology.

Yep. Sometimes you want to introduce recombination centers to kill the lifetime. Nowadays they zap the wafer with radiation to do this.

Yup. Started BASIC in 3rd grade at public elementary school in Tampa. Fast forward today: I asked my son what they do in his computer class, and he said "we made a song in Garage Band". WTF

Thanks for the spoiler, Slashdot.

Am I the only one who hasn't watched this supposed piece of crap movie?

This. Wife knows my computer password, and Chrome knows the rest. What the f*ck do I care? I'm dead!

Came here to say this. Silicon wins again.

Wondering this too. If I'm gonna spend this much, I want an Ice Cream Sandwich phone, not something made to run last year's software.

You were talking about integrated microchannels for cooling, right? Or through hole vias patterned into the die? That's what I'm talking about. Digging holes in the crystal and/or depositing metal both cause the wafer to warp.

synthetic diamonds

When diamond becomes as cheap and plentiful as silicon... Lots of research already into using diamond for high voltage power semiconductor devices.

The more 3D features you pattern onto a wafer, the more mechanical stress you create. This is especially true when you integrate features with different materials and different coefficients of thermal expansion. Such features can increase the warpage and bow of the wafer to such a point, that the fabrication equipment can no longer handle the wafer. It becomes like trying to feed a potato chip into a CD changer.

The larger the wafer, the worse this problem becomes, and today they're running very large 12" wafers that are quite sensitive to mechanical stress. Also, the SOI wafers are more prone to warpage than single crystal silicon.

So, the *real* 3D integration you're taking about is very difficult.

Umm... call me crazy, but maybe she was retaliating for him repeatedly beating the crap out of her.

the mobile site got a huge overhaul by comparison, complete with bloaty icons. just what I needed. slower load times when I open my phone's browser.