Comment Re:Ground breaking (Score 5, Interesting) 137
Mainly, most immediately, it gives you an additional way to make a diode or diode-based structure when you're designing your fabrication sequence. Fabrication on the foundry / mass-production level occurs through processes which give you pretty much a set sequence of layers (deposited materials, treatments, patterning, etching, etc.). You can make anything you can design within that process...and most anything else usually stays in a research lab.
The extraordinarily common CMOS process involves numerous metal layers "high" above the wafer (numerous layers intervene). These are separated by insulators. Normally, you make diodes at the wafer layer where you're doing your doping.
MiM means you can put diodes in regions of your chip where they couldn't practically be fabricated before without a lot of time doing a one-off chip in a lab. With "a lot" often being several months to a year, assuming everything turns out perfectly, assuming your lab even HAS all the necessary equipment, and assuming you don't have something better to do - which is rare if you're not still a grad student.