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ease
features
design
support

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Description

Lenovo's high-density systems provide significant computational power within a compact footprint, making them ideal for demanding tasks such as High-Performance Computing (HPC), Artificial Intelligence (AI), cloud services, grid computing, and data analytics. In today's fast-paced technological environment, it's crucial for servers to feature contemporary designs. Our high-density servers are equipped to handle even the most intricate simulations effortlessly. These robust systems are specifically engineered to meet your needs across the fields of artificial intelligence, cloud computing, grid services, and analytics. Furthermore, designed with scalability in mind, our innovative water-cooled solutions prioritize security while maximizing density. Combining liquid cooling technology with exemplary energy efficiency, the ThinkSystem stands out as a smart choice. This approach ensures that all the processing power you require is housed in a sleek and efficient package. By employing advanced heat removal techniques that outperform traditional air cooling, essential components maintain lower operating temperatures, leading to enhanced performance in a system that runs quietly and efficiently. Ultimately, Lenovo's dense systems represent a blend of power, security, and innovation, making them a valuable asset for any modern enterprise.

Description

The 3U systems can accommodate 24, 12, or 8 nodes, featuring 4 DIMM slots each, with options for hot-swappable 3.5” or 2.5” NVMe/SAS3/SATA3 drives. Enhanced by onboard 10 Gigabit Ethernet, these systems are designed for optimal cost-effectiveness. The MicroCloud’s modular design ensures high density, ease of maintenance, and affordability, which are critical for modern hyper-scale operations. Integrated within a compact 3U chassis measuring under 30 inches in depth, these modular server nodes can save over 76% of rack space compared to conventional 1U servers. This family of MicroCloud servers specializes in single socket computing, optimized for hyper-scale data centers, utilizing the latest power-efficient and high-density system-on-chip (SoC) processors, including the Intel® Xeon® E/D/E3/E5 and Intel® Atom® C Processors, allowing for diverse and scalable cloud and edge computing solutions. Conveniently, power and I/O ports are positioned at the front of the chassis, facilitating quick server provisioning, upgrades, and maintenance tasks, enhancing operational efficiency further.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

GB Network Solutions
GPU.ai
RAVEL Orchestrate
Relianoid
Stor2RRD
StorMagic SvSAN
TensorWave
Windows Admin Center

Integrations

GB Network Solutions
GPU.ai
RAVEL Orchestrate
Relianoid
Stor2RRD
StorMagic SvSAN
TensorWave
Windows Admin Center

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Lenovo

Country

United States

Website

www.lenovo.com/us/en/c/servers-storage/servers/high-density/

Vendor Details

Company Name

Supermicro

Country

United States

Website

www.supermicro.com/en/products/microcloud

Product Features

Product Features

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Alternatives

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