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Average Ratings 0 Ratings

Total
ease
features
design
support

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Description

Providing adaptable performance options tailored for data centers of varying sizes, this system supports advanced storage technologies such as E3.S and E1.S, PCIe Gen5, and CXL. It sets a new standard for power efficiency by enhancing PSU density by as much as 4%. Promoting open collaboration significantly boosts product reliability and operational efficiency. An increase in redundancy for BIOS/BMC and critical components ensures stable performance, while enhanced security measures such as boot memory inspection and MFP memory protection fortify system integrity. Software-designed hardware redundancy minimizes both system downtime and energy consumption. Cloud-driven operations and maintenance achieve fault diagnosis accuracy of up to 95%. Comprehensive liquid cooling solutions are in place, alongside intelligent temperature management and hardware designs that optimize heat dissipation. Innovative packing technology leads to a 90% reduction in material volume and a 30% decrease in plastic waste. Additionally, dynamic power management facilitates a 15% reduction in energy use, all while providing real-time monitoring of carbon emissions. As a result, this holistic approach not only enhances performance but also drives sustainability in data center operations.

Description

The 3U systems can accommodate 24, 12, or 8 nodes, featuring 4 DIMM slots each, with options for hot-swappable 3.5” or 2.5” NVMe/SAS3/SATA3 drives. Enhanced by onboard 10 Gigabit Ethernet, these systems are designed for optimal cost-effectiveness. The MicroCloud’s modular design ensures high density, ease of maintenance, and affordability, which are critical for modern hyper-scale operations. Integrated within a compact 3U chassis measuring under 30 inches in depth, these modular server nodes can save over 76% of rack space compared to conventional 1U servers. This family of MicroCloud servers specializes in single socket computing, optimized for hyper-scale data centers, utilizing the latest power-efficient and high-density system-on-chip (SoC) processors, including the Intel® Xeon® E/D/E3/E5 and Intel® Atom® C Processors, allowing for diverse and scalable cloud and edge computing solutions. Conveniently, power and I/O ports are positioned at the front of the chassis, facilitating quick server provisioning, upgrades, and maintenance tasks, enhancing operational efficiency further.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

GB Network Solutions
GPU.ai
RAVEL Orchestrate
Relianoid
TensorWave

Integrations

GB Network Solutions
GPU.ai
RAVEL Orchestrate
Relianoid
TensorWave

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Inspur

Country

United States

Website

www.inspursystems.com/g7-series/

Vendor Details

Company Name

Supermicro

Country

United States

Website

www.supermicro.com/en/products/microcloud

Product Features

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