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ease
features
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support

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Description

Providing adaptable performance options tailored for data centers of varying sizes, this system supports advanced storage technologies such as E3.S and E1.S, PCIe Gen5, and CXL. It sets a new standard for power efficiency by enhancing PSU density by as much as 4%. Promoting open collaboration significantly boosts product reliability and operational efficiency. An increase in redundancy for BIOS/BMC and critical components ensures stable performance, while enhanced security measures such as boot memory inspection and MFP memory protection fortify system integrity. Software-designed hardware redundancy minimizes both system downtime and energy consumption. Cloud-driven operations and maintenance achieve fault diagnosis accuracy of up to 95%. Comprehensive liquid cooling solutions are in place, alongside intelligent temperature management and hardware designs that optimize heat dissipation. Innovative packing technology leads to a 90% reduction in material volume and a 30% decrease in plastic waste. Additionally, dynamic power management facilitates a 15% reduction in energy use, all while providing real-time monitoring of carbon emissions. As a result, this holistic approach not only enhances performance but also drives sustainability in data center operations.

Description

Data Center Optimized (DCO) solutions are crafted to meet the intricate demands of floor space and energy consumption, ultimately reducing the Total Cost of Ownership (TCO). They feature enhanced thermal design and highly efficient power supplies to support data center functionalities. The compact design caters to server installations where availability of space and electricity is constrained. These systems can accommodate up to 8 DIMM slots and provide a maximum of 2TB DDR4 memory alongside Intel® Optane™ DC persistent memory. Equipped with dual Intel® Xeon® Scalable processors, they have a thermal design power (TDP) of up to 140W. Additionally, they can house up to 8x 2.5" drives or 4x 3.5" drives within a 1U form factor, and include 1 PCI-E FHHL expansion slot. The use of power-efficient components and high-efficiency power supplies, achieving up to 94% Platinum Level, enables operation at elevated temperatures. Many DCO servers feature a chassis depth of less than 20 inches, which enhances deployment options and operational efficiency. Supermicro Ultra SuperServers are engineered to provide outstanding performance, adaptability, scalability, and ease of service in demanding IT settings, making them ideal for a wide range of enterprise applications. These attributes contribute to a robust infrastructure capable of meeting the ever-evolving needs of modern data centers.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

No details available.

Integrations

No details available.

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Inspur

Country

United States

Website

www.inspursystems.com/g7-series/

Vendor Details

Company Name

Supermicro

Country

United States

Website

www.supermicro.com/en/products/dco

Product Features

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