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Description

The HPE Cray exascale supercomputers represent a groundbreaking design, developed from scratch to efficiently manage the extensive demands of modern converged modeling, simulation, artificial intelligence, and analytics tasks. This marks the dawn of a new chapter in supercomputing technology. The innovations in HPE Cray supercomputers stand as one of the most pivotal advancements in technology we have seen in recent decades. With these machines, we are enabling transformative capabilities for the complex questions of our time. HPE Cray supercomputers embody the future of computing, designed to support the evolving landscape of science, discovery, and achievement. Rethought and meticulously engineered, this solution responds to the diverse requirements of today's digital age. Through a combination of advanced hardware and software innovations, we are addressing the complexities that arise from increasing core counts, the diversification of compute node architectures, and the necessity for scalable AI workflows, paving the way for unprecedented progress in various fields. The ability to tackle such challenges is what truly sets these supercomputers apart.

Description

Providing adaptable performance options tailored for data centers of varying sizes, this system supports advanced storage technologies such as E3.S and E1.S, PCIe Gen5, and CXL. It sets a new standard for power efficiency by enhancing PSU density by as much as 4%. Promoting open collaboration significantly boosts product reliability and operational efficiency. An increase in redundancy for BIOS/BMC and critical components ensures stable performance, while enhanced security measures such as boot memory inspection and MFP memory protection fortify system integrity. Software-designed hardware redundancy minimizes both system downtime and energy consumption. Cloud-driven operations and maintenance achieve fault diagnosis accuracy of up to 95%. Comprehensive liquid cooling solutions are in place, alongside intelligent temperature management and hardware designs that optimize heat dissipation. Innovative packing technology leads to a 90% reduction in material volume and a 30% decrease in plastic waste. Additionally, dynamic power management facilitates a 15% reduction in energy use, all while providing real-time monitoring of carbon emissions. As a result, this holistic approach not only enhances performance but also drives sustainability in data center operations.

API Access

Has API

API Access

Has API

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Screenshots View All

Integrations

No details available.

Integrations

No details available.

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Hewlett Packard

Founded

2015

Country

United States

Website

www.hpe.com/us/en/compute/hpc/supercomputing/cray-exascale-supercomputer.html

Vendor Details

Company Name

Inspur

Country

United States

Website

www.inspursystems.com/g7-series/

Product Features

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