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Average Ratings 0 Ratings

Total
ease
features
design
support

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Write a Review

Description

Ansys Totem-SC stands out as the established and reliable leader in the realm of power noise and reliability validation for both analog and mixed-signal designs, utilizing a cloud-native elastic compute framework. Recognized as the benchmark solution for voltage drop and electromigration multiphysics sign-off at the transistor level, Ansys Totem-SC has proven its effectiveness across numerous tapeouts, leveraging a cloud-based infrastructure to provide the necessary speed and capacity for comprehensive full-chip assessments. Its accuracy in signoff has been validated by all major foundries, supporting advanced finFET technologies down to 3nm. This platform excels in power noise and reliability analysis specifically for analog mixed-signal intellectual property and fully custom designs. Moreover, it generates IP models that facilitate SOC-level power integrity signoff in conjunction with RedHawk-SC and develops compact chip models for power delivery networks applicable at both chip and system levels. The solution is not only industry-proven but also certified by foundries, making it a highly regarded choice for analog and mixed-signal electromigration and IR analysis. With Ansys Totem-SC, designers can confidently ensure the integrity and reliability of their power delivery systems throughout the design process.

Description

Cadence Celsius PowerDC technology offers efficient DC analysis to ensure reliable power delivery. This includes electrical/thermal simulations for maximum accuracy. The Celsius PowerDC technology quickly identifies areas of excessive IR drop and thermal hotspots to minimize the risk of failure of your design. Highly accurate, even with complex designs that have multiple voltage domains, complex plane structures and multiple voltage domains, providing conclusive IR analysis for board and package. DC simulations can be automatically set up using PowerTree Technology (source/sink defintions) captured during the schematic stage of design. Support for multi-structures, including stacked boards, multiple die, and all popular packaging types.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

AutoCAD
CryptoTax360°
Sigrity X Platform

Integrations

AutoCAD
CryptoTax360°
Sigrity X Platform

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Ansys

Founded

1970

Country

United States

Website

www.ansys.com/products/semiconductors/ansys-totem

Vendor Details

Company Name

Cadence Design Systems

Founded

1988

Country

United States

Website

www.cadence.com

Product Features

Simulation

1D Simulation
3D Modeling
3D Simulation
Agent-Based Modeling
Continuous Modeling
Design Analysis
Direct Manipulation
Discrete Event Modeling
Dynamic Modeling
Graphical Modeling
Industry Specific Database
Monte Carlo Simulation
Motion Modeling
Presentation Tools
Stochastic Modeling
Turbulence Modeling

Product Features

PCB Design

3D Visualization
Autorouting
Collaboration Tools
Component Library
Design Rule Check
Differential Pair Routing
Schematic Editor

Alternatives

Alternatives

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AWR Design Environment Platform

Cadence Design Systems