Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
Description
RadCAD employs an advanced, oct-tree accelerated Monte-Carlo ray tracing algorithm to calculate radiation exchange factors and view factors with remarkable speed. The enhancements introduced by C&R Technologies in the ray tracing methodology have led to the development of a highly efficient thermal radiation analysis tool. By utilizing finite difference "conics" or curved finite elements from TD Direct®, RadCAD is capable of precisely simulating diffuse and specular reflections as well as transmissive surfaces, independent of node density. The thermal solution's requirements govern the node quantity, rather than the precision needed for radiation calculations. Furthermore, RadCAD allows users to create custom databases that specify optical properties, with each surface coating detailing its absorptivity, transmissivity, reflectivity, and specularity in both solar and infrared wavelengths. These optical characteristics can be tailored to account for variations in incident angles or wavelength dependencies, enhancing the accuracy and relevance of thermal modeling. Ultimately, this level of customization ensures that RadCAD meets diverse analytical needs across various applications.
API Access
Has API
No
API Access
Has API
No
Integrations
Ansys Electronics Desktop (AEDT)
Yes
Ansys Fluent
Yes
Thermal Desktop
No
Integrations
Ansys Electronics Desktop (AEDT)
No
Ansys Fluent
No
Thermal Desktop
Yes
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
Yes
Chromebook
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Types of Training
Training Docs
Yes
Webinars
No
Live Training (Online)
No
In Person
No
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Vendor Details
Company Name
C&R Technologies
Founded
1992
Country
United States
Website
www.crtech.com/products/radcad
Product Features
CAD
2 1/2-Axis Milling
No
2D Drawing
No
3-Axis Milling
No
3D Modeling
No
4-Axis Milling
No
5-Axis Milling
No
Civil
No
Collaboration
No
Database Connectivity
No
Design Analysis
No
Design Export
No
Document Management
No
Electrical
No
Hole Making
No
Mechanical
No
Mechatronics
No
Presentation Tools
No
Simulate Cycles
No
Spiral Output
No
Structural Engineering
No
Toolpath Simulation
No
User Defined Cycles
No