Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
Description
Multisim™ software combines industry-standard SPICE simulation with an interactive schematic environment that allows for the immediate visualization and analysis of electronic circuit behavior. Its user-friendly interface is designed to assist educators in reinforcing circuit theory and enhancing students' retention of concepts throughout their engineering studies. By integrating robust circuit simulation and analysis into the design workflow, Multisim™ enables researchers and designers to minimize the number of printed circuit board (PCB) prototypes needed, thus reducing development costs significantly. Specifically tailored for educational purposes, Multisim™ serves as a teaching application for analog, digital, and power electronics courses and labs. With its comprehensive suite of SPICE simulation, analysis, and PCB design tools, Multisim™ empowers engineers to efficiently iterate on their designs and enhance the performance of their prototypes while fostering a deeper understanding of electronic principles. This software not only streamlines the design process but also cultivates a hands-on learning experience for students in the field of electronics.
API Access
Has API
API Access
Has API
Integrations
Ansys Electronics Desktop (AEDT)
Ansys Fluent
Pricing Details
No price information available.
Free Trial
Free Version
Pricing Details
No price information available.
Free Trial
Free Version
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Vendor Details
Company Name
NI
Founded
1976
Country
United States
Website
www.ni.com/en-us/shop/electronic-test-instrumentation/application-software-for-electronic-test-and-instrumentation-category/what-is-multisim.html
Product Features
PCB Design
3D Visualization
Autorouting
Collaboration Tools
Component Library
Design Rule Check
Differential Pair Routing
Schematic Editor