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ease
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support

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Average Ratings 0 Ratings

Total
ease
features
design
support

No User Reviews. Be the first to provide a review:

Write a Review

Description

Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.

Description

Moldflow® simulation software provides a comprehensive solution for addressing issues associated with plastic injection and compression molding processes. With its advanced features and user-friendly interface, it effectively tackles manufacturing challenges, including part warpage, enhancing cooling channel performance, and reducing cycle times. By fostering collaboration among product design teams, it helps to reduce delays and minimize rework expenses. Autodesk Drive and shared view functionalities facilitate seamless content collaboration, while in-product Fusion 360 enables rapid geometry modifications. Furthermore, automation tools streamline both setup and post-processing tasks. The software enhances solver flexibility to boost overall capacity and mitigates hardware limitations with Moldflow Insight. Users can mesh and solve Insight jobs using local, remote, and secure cloud server options, allowing for multiple simulations to be conducted simultaneously. It also provides secure storage, previewing, and sharing of design data, enabling efficient communication with stakeholders. Additionally, users can easily upload a .csv file to quickly add and assign numerous users in one go, significantly improving team management and collaboration efficiency. This adaptability allows teams to work more effectively and respond to changes in project needs swiftly.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Ansys

Country

United States

Website

www.ansys.com/products/electronics/ansys-icepak

Vendor Details

Company Name

Autodesk

Founded

1982

Country

United States

Website

www.autodesk.com/products/moldflow/overview

Product Features

Product Features

Engineering

2D Drawing
3D Modeling
Chemical Engineering
Civil Engineering
Collaboration
Design Analysis
Design Export
Document Management
Electrical Engineering
Mechanical Engineering
Mechatronics
Presentation Tools
Structural Engineering

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