Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
Description
Moldflow® simulation software provides a comprehensive solution for addressing issues associated with plastic injection and compression molding processes. With its advanced features and user-friendly interface, it effectively tackles manufacturing challenges, including part warpage, enhancing cooling channel performance, and reducing cycle times. By fostering collaboration among product design teams, it helps to reduce delays and minimize rework expenses. Autodesk Drive and shared view functionalities facilitate seamless content collaboration, while in-product Fusion 360 enables rapid geometry modifications. Furthermore, automation tools streamline both setup and post-processing tasks. The software enhances solver flexibility to boost overall capacity and mitigates hardware limitations with Moldflow Insight. Users can mesh and solve Insight jobs using local, remote, and secure cloud server options, allowing for multiple simulations to be conducted simultaneously. It also provides secure storage, previewing, and sharing of design data, enabling efficient communication with stakeholders. Additionally, users can easily upload a .csv file to quickly add and assign numerous users in one go, significantly improving team management and collaboration efficiency. This adaptability allows teams to work more effectively and respond to changes in project needs swiftly.
API Access
Has API
No
API Access
Has API
No
Integrations
Ansys Electronics Desktop (AEDT)
No
Ansys Fluent
No
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
Yes
Chromebook
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
Yes
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Vendor Details
Company Name
Autodesk
Founded
1982
Country
United States
Website
www.autodesk.com/products/moldflow/overview
Product Features
Engineering
2D Drawing
No
3D Modeling
No
Chemical Engineering
No
Civil Engineering
No
Collaboration
No
Design Analysis
No
Design Export
No
Document Management
No
Electrical Engineering
No
Mechanical Engineering
No
Mechatronics
No
Presentation Tools
No
Structural Engineering
No