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Average Ratings 0 Ratings

Total
ease
features
design
support

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Write a Review

Description

Ansys HFSS is a versatile 3D electromagnetic (EM) simulation tool used for the design and analysis of high-frequency electronic devices such as antennas, interconnects, connectors, integrated circuits (ICs), and printed circuit boards (PCBs). This powerful software allows engineers to create and evaluate a wide range of high-frequency electronic products, including antenna arrays, RF and microwave components, and filters. Renowned among engineers globally, Ansys HFSS is essential for developing high-speed electronics utilized in various applications like communication systems, advanced driver assistance systems (ADAS), satellites, and Internet of Things (IoT) devices. The software's exceptional performance and precision empower engineers to tackle complex challenges related to RF, microwave, IC, PCB, and electromagnetic interference (EMI) issues. With a robust suite of solvers, Ansys HFSS effectively addresses a myriad of electromagnetic challenges, making it an indispensable resource in the field of electronic design. As technology progresses, the relevance of such simulation tools becomes increasingly critical in ensuring optimal performance in modern electronic systems.

Description

Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansysโ€™ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Ansys

Founded

1970

Country

United States

Website

www.ansys.com/products/electronics/ansys-hfss

Vendor Details

Company Name

Ansys

Country

United States

Website

www.ansys.com/products/electronics/ansys-icepak

Product Features

Computer-Aided Engineering (CAE)

CAD/CAM Compatibility
Finite Element Analysis
Fluid Dynamics
Import / Export Files
Integrated 3D Modeling
Manufacturing Process Simulation
Mechanical Event Simulation
Multibody Dynamics
Thermal Analysis

PCB Design

3D Visualization
Autorouting
Collaboration Tools
Component Library
Design Rule Check
Differential Pair Routing
Schematic Editor

Product Features

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