Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys SpaceClaim offers a distinctive user interface, innovative modeling technology, and a versatile set of tools that facilitate the creation and modification of imported geometries without the intricacies often found in conventional CAD systems. While managing existing CAD models, users can effortlessly de-feature and streamline geometry using automated tools that are straightforward to master. This software is particularly suited for engineers who require rapid 3D solutions but lack the time to navigate elaborate CAD tools. SpaceClaim equips analysts with capabilities that expedite geometry preparation for simulations, whether that involves de-featuring CAD models, isolating fluid domains, or converting a model to beam and shell elements. By alleviating geometry-related obstacles, SpaceClaim allows analysts to concentrate on their simulations without interruption. With enhanced control over geometry, analysts can foster simulation-driven design, reduce delays between design and analysis teams, and quickly assess how modifications to designs affect outcomes, ultimately leading to more efficient workflows and better project results. Consequently, the integration of SpaceClaim into engineering practices significantly enhances productivity and collaboration.
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
API Access
Has API
API Access
Has API
Integrations
Ansys Electronics Desktop (AEDT)
Ansys Fluent
Beamy
BoltsEtAl
FreeMILL
Gears
Innoslate
Key Ward
NCG CAM
PikeOS
Integrations
Ansys Electronics Desktop (AEDT)
Ansys Fluent
Beamy
BoltsEtAl
FreeMILL
Gears
Innoslate
Key Ward
NCG CAM
PikeOS
Pricing Details
No price information available.
Free Trial
Free Version
Pricing Details
No price information available.
Free Trial
Free Version
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Vendor Details
Company Name
ANSYS
Founded
1970
Country
United States
Website
www.ansys.com/products/3d-design/ansys-spaceclaim
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Product Features
CAD
2 1/2-Axis Milling
2D Drawing
3-Axis Milling
3D Modeling
4-Axis Milling
5-Axis Milling
Civil
Collaboration
Database Connectivity
Design Analysis
Design Export
Document Management
Electrical
Hole Making
Mechanical
Mechatronics
Presentation Tools
Simulate Cycles
Spiral Output
Structural Engineering
Toolpath Simulation
User Defined Cycles
Engineering
2D Drawing
3D Modeling
Chemical Engineering
Civil Engineering
Collaboration
Design Analysis
Design Export
Document Management
Electrical Engineering
Mechanical Engineering
Mechatronics
Presentation Tools
Structural Engineering