I should have been more specific, but the term "additive manufacturing" is usually used for processes that make 3D shapes out of homogeneous materials - especially in this context. Assembly, bonding, finishing, and other processes that combine materials are a different matter.
In the case of TFA, the assembly is all done by hand and the point of interest is the means of manufacture of the board that forms the structural base for the circuit. Never in a million years would you make a two-layer PCB that didn't have to be drilled before you put in the barrel inserts.
Incidentally, in the context of shaping materials, there are lots of processes which are neither additive nor subtractive like rolling, extrusion and anything involving moulds.