Sigrity X Platform Integrations

Sigrity X Aurora, seamlessly integrated with all Allegro X Platforms, empowers designers to quickly identify and rectify signal and power integrity challenges early in the process, thereby reducing reliance on expert reviews and helping projects remain on track and within financial constraints. This integrated in-design analysis approach facilitates thorough signal and power integrity evaluations at each phase of the design process, allowing for detailed "what if" scenario assessments that establish accurate constraints and decrease the need for multiple iterations. Step into a future where signal and power integrity in PCB and IC design is transformed by an intuitive, user-friendly platform that enhances efficiency. With Sigrity X, innovation converges with optimization, providing the tools needed for impeccable signal and power integrity in your PCB and IC package designs. Propel your projects beyond the existing boundaries of signal integrity (SI) and power integrity (PI) technology, and envision a world where navigating the challenges of electronic design is effortless. Not only will you meet your deadlines, but you will exceed your time-to-market goals with remarkable accuracy and speed. The future of electronic design is bright with Sigrity X.

Sigrity X Advanced SI Technology offers advanced signal integrity analysis for PCBs and IC packaging, covering DC up to 56GHz, with features such as automated die-todie SI analysis, topology exploring, and simulation of high-speed interfaces. It supports IBIS-AMI and customizable compliance kits to ensure that your designs meet rigorous standards.

Cadence®, Sigrity X OptimizationPI™ technology performs a complete AC frequency analyzer of boards and IC package to ensure high performance and save between 15% and 50 % in decoupling capacitor costs. It supports both pre-and post-layout studies and quickly pinpoints the most cost-effective decap selections. Sigrity X OptimizePI is based on proven Cadence hybrid magnetic circuit analysis technology combined with the unique Sigrity Optimization engine to help you quickly identify the best possible placement and decap locations.

Cadence Celsius PowerDC technology offers efficient DC analysis to ensure reliable power delivery. This includes electrical/thermal simulations for maximum accuracy. The Celsius PowerDC technology quickly identifies areas of excessive IR drop and thermal hotspots to minimize the risk of failure of your design. Highly accurate, even with complex designs that have multiple voltage domains, complex plane structures and multiple voltage domains, providing conclusive IR analysis for board and package. DC simulations can be automatically set up using PowerTree Technology (source/sink defintions) captured during the schematic stage of design. Support for multi-structures, including stacked boards, multiple die, and all popular packaging types.

Cadence®, Sigrity X PowerSI® technology helps you to tackle increasingly difficult issues related switching noise, signal coupling and target voltage levels. It provides fast, accurate and detailed electrical analyses of full IC packages and PCBs. It can be used to develop power and signal integrity guidelines before layout, or after layout to verify performance and improve the design without a prototype. Sigrity X's electromagnetic (EM) solver technology allows you to perform a wide range of studies, including identifying trace and via coupling problems, power/ground fluctuation caused by simultaneously switching out put, and designing regions that are below or above voltage targets. PowerSI technology allows you to extract frequency-dependent parameter models for network networks and visualize complex spatial relationships.