Alternatives to EMWorks

Utilize COMSOL's multiphysics software to replicate real-world designs, devices, and processes effectively. This versatile simulation tool is grounded in sophisticated numerical techniques. It boasts comprehensive capabilities for both fully coupled multiphysics and single-physics modeling. Users can navigate a complete modeling workflow, starting from geometry creation all the way to postprocessing. The software provides intuitive tools for the development and deployment of simulation applications. COMSOL Multiphysics® ensures a consistent user interface and experience across various engineering applications and physical phenomena. Additionally, specialized functionality is available through add-on modules that cater to fields such as electromagnetics, structural mechanics, acoustics, fluid dynamics, thermal transfer, and chemical engineering. Users can select from a range of LiveLink™ products to seamlessly connect with CAD systems and other third-party software. Furthermore, applications can be deployed using COMSOL Compiler™ and COMSOL Server™, enabling the creation of physics-driven models and simulation applications within this robust software ecosystem. With such extensive capabilities, it empowers engineers to innovate and enhance their projects effectively.

Ansys MotorCAD is a dedicated tool for electric machine design. It allows you to quickly simulate multiphysics across the entire torque-speed operating range. Motor-CAD allows engineers to evaluate motor topologies across the entire operating range. This allows them to create designs that are optimized for size, efficiency, and performance. Motor-CAD software's four modules, Emag, Therm Lab, Mech, allow multiphysics calculations to be performed quickly, iteratively, and users can move from concept to final design in a shorter time. Motor-CAD users can explore more motor topologies and fully evaluate the impact of advanced loss effects during the initial stages of an electrical mechanical design with Motor-CAD's streamlined data input process. This release features powerful new features for design optimization and multi-physics analysis, as well as system modeling for electric motors. Multiphysics simulations are fast across the entire torque-speed range.

samadii/em oftware that analyzes and calculates the electromagnetic field in 3d space using the Maxwell equation using vector FEM ad GPU computing. it provides electrostatics, magnetostatics as well and induction electronics, including the low-frequency and high-frequency ranges. samadii/em provides a multi-physics approach and high-performance electromagnetics simulation, with Samadii you can quickly address problems from semiconductors and displays to wireless communications, etc.

Utilizing the 3DEXPERIENCE® platform, SIMULIA provides advanced simulation tools that help users better understand and analyze our environment. The applications offered by SIMULIA streamline the assessment of material and product performance, reliability, and safety prior to the development of physical prototypes. These tools deliver robust simulations for various scenarios such as structures, fluids, multibody interactions, and electromagnetics, all while being seamlessly integrated with product data, even for complex assemblies. The comprehensive technology for modeling, simulation, and visualization is fully embedded within the 3DEXPERIENCE platform, which includes capabilities for process capture, publication, and reuse. By allowing simulation data, outcomes, and intellectual property to be linked to the platform, customers can maximize their current investment in simulation capabilities, transforming these assets into valuable resources that foster innovation for all users involved. This integration not only enhances workflow efficiency but also encourages collaborative advancements across different teams and projects.

Metariver Technology Co., Ltd. develops innovative and creative computer-aided engineering (CAE) analysis S/W based upon the most recent HPC technology and S/W technologies including CUDA technology. We are changing the paradigm in CAE technology by using particle-based CAE technology, high-speed computation technology with GPUs, and CAE analysis software. Here is an introduction to our products. 1. Samadii-DEM: works with discrete element method and solid particles. 2. Samadii-SCIV (Statistical Contact In Vacuum): working with high vacuum system gas-flow simulation. 3. Samadii-EM (Electromagnetics) : For full-field interpretation 4. Samadii-Plasma: For Analysis of ion and electron behavior in an electromagnetic field. 5. Vampire (Virtual Additive Manufacturing System): Specializes in transient heat transfer analysis.

Ansys HFSS is a versatile 3D electromagnetic (EM) simulation tool designed for the creation and analysis of high-frequency electronic devices, including antennas, components, interconnects, connectors, integrated circuits (ICs), and printed circuit boards (PCBs). This software empowers engineers to effectively model and simulate a wide range of high-frequency electronic products such as antenna arrays, RF and microwave components, high-speed interconnects, filters, and IC packages. Used globally, Ansys HFSS is essential for designing high-speed electronics crucial to communications systems, advanced driver assistance systems (ADAS), satellite technology, and internet-of-things (IoT) applications. With its unparalleled capabilities and exceptional accuracy, HFSS allows engineers to tackle RF, microwave, IC, PCB, and EMI challenges in even the most intricate systems. The HFSS simulation suite features a robust array of solvers that cater to a variety of electromagnetic issues, ensuring comprehensive coverage for engineers working in advanced electronic design. Ultimately, Ansys HFSS stands out as a powerful solution, enabling innovation and efficiency in the field of high-frequency electronics.

CST Studio Suite is an advanced 3D electromagnetic (EM) analysis software designed to facilitate the design, assessment, and optimization of various electromagnetic components and systems. It offers a unified user interface that houses solvers for a diverse range of applications spanning the entire electromagnetic spectrum. These solvers can be integrated to conduct hybrid simulations, providing engineers the versatility to efficiently analyze complex systems composed of multiple components. Furthermore, collaboration with other SIMULIA products enhances the capability for EM simulation to be seamlessly incorporated into the overall design process, influencing development from the initial phases. Typical applications of EM analysis include evaluating antenna and filter performance, ensuring electromagnetic compatibility and interference compliance, assessing human exposure to EM fields, analyzing electro-mechanical interactions in motors and generators, and studying thermal impacts on high-power devices. The ability to conduct such comprehensive analyses helps drive innovation in various industries that rely on electromagnetic technology.

XFdtd is a comprehensive 3D electromagnetic simulation software developed by Remcom. This powerful and feature-rich solver for electromagnetic simulations delivers exceptional computing performance and eases the process of analyzing intricate electromagnetic challenges. The software supports various applications, including the design of microwave devices and antennas, as well as radar and scattering analysis. Additionally, XFdtd is utilized in biomedical fields, automotive radar systems, waveguide studies, military and defense projects, RFID technology, and electromagnetic compatibility/electromagnetic interference assessments, among others. Its versatility makes it an essential tool for engineers and researchers alike.

The Cadence Clarity 3D Solver is a sophisticated software tool designed for 3D electromagnetic simulation, specifically aimed at creating essential interconnects for printed circuit boards, integrated circuit packages, and systems integrated on chip designs. This powerful tool assists engineers in overcoming intricate electromagnetic issues encountered in the development of systems for advanced technologies such as 5G, automotive applications, high-performance computing, and machine learning, all while ensuring top-tier accuracy. Leveraging Cadence’s state-of-the-art distributed multiprocessing capabilities, the Clarity 3D Solver provides virtually limitless capacity and enhances processing speed by tenfold, making it possible to tackle extensive and complicated structures with ease. Additionally, it generates precise S-parameter models that cater to high-speed signal integrity, power integrity, high-frequency RF/microwave applications, and electromagnetic compliance assessments, ensuring that simulation outcomes align closely with laboratory measurements, even for data transfer rates exceeding 112Gbps. Consequently, this tool stands as a vital asset for engineers looking to push the boundaries of technology in their designs.

Subjecting your designs to real-world scenarios can significantly enhance product quality while simultaneously minimizing the costs associated with prototyping and physical testing. The SOLIDWORKS® Simulation suite offers a user-friendly collection of structural analysis tools that employ Finite Element Analysis (FEA) to forecast how a product will behave in actual physical conditions by virtually evaluating CAD models. This comprehensive portfolio is equipped with capabilities for both linear and non-linear static and dynamic analyses. With SOLIDWORKS Simulation Professional, you can refine your designs by assessing mechanical resistance, durability, topology, natural frequencies, as well as examining heat transfer and potential buckling issues. Additionally, it facilitates sequential multi-physics simulations to enhance design accuracy. On the other hand, SOLIDWORKS Simulation Premium allows for an in-depth assessment of designs concerning nonlinear and dynamic responses, dynamic loading conditions, and composite materials. This advanced tier also features three specialized studies: Non-Linear Static, Non-Linear Dynamic, and Linear Dynamics, ensuring a thorough evaluation of your engineering projects. By leveraging these powerful tools, engineers can achieve greater design confidence and innovation.

Embrace the future with the Sigrity X Platform, where cutting-edge innovation harmonizes with peak optimization. Gain access to unparalleled signal and power integrity for your PCB and IC package designs, propelling you far past the existing boundaries of signal integrity (SI) and power integrity (PI) technology. Picture yourself skillfully navigating the intricate challenges of electronic design, achieving not just your targets but exceeding them with remarkable efficiency and accuracy. With Sigrity X, you’re engaging with a transformative tool that fosters a seamless integration of in-design analysis within the Allegro X PCB and IC Package platforms. Immerse yourself in an extensive array of SI/PI analysis, in-design interconnect modeling, and PDN analysis tools that are specifically engineered to elevate your performance, ensuring that your projects consistently surpass expectations and stay within timeframes and budgets. Leverage the capabilities of the Sigrity X Platform to guarantee exceptional performance and reliability in your upcoming designs, setting a new standard for success. This is your opportunity to redefine what is possible in electronic design and lead the way in innovation.

FEATool Multiphysics – "Physics Simulator Made Easy" – a fully integrated physics simulation, FEA and CFD toolbox. FEATool Multiphysics provides a fully integrated simulation platform that includes a unified user interface for several multi-physics solvers such as OpenFOAM and Computational fluid dynamics (CFD), including SU2 Code and FEniCS. This allows users to model coupled physics phenomena, such as those found in fluid flow and heat transfer, structural, electromagnetics acoustics and chemical engineering applications. FEATool multiphysics is a trusted tool for engineers and researchers in the energy, automotive and semi-conductor industries.

HyperLynx offers integrated capabilities for signal integrity, power integrity, 3D electromagnetic modeling, and electrical rule checking tailored for high-speed digital designs. By merging user-friendly features with automated processes, HyperLynx makes high-speed design analysis accessible for mainstream system designers, enabling early identification and resolution of potential issues within the design cycle. It seamlessly integrates with various PCB tools, making it a valuable addition to any PCB design workflow. The HyperLynx suite ensures a comprehensive analysis pipeline, fusing best-practice design rule checking with in-depth simulations for both signal and power integrity. Equipped with advanced 3D electromagnetic solvers, it produces precise interconnect models that enhance the design process. Users can assess design trade-offs during the pre-layout phase and confirm their designs before fabrication with thorough post-layout analyses. This tool supports a range of applications, including SerDes channels, DDRx memory interfaces, and general signal integrity assessments. Additionally, it simplifies the design and validation of a board's power-delivery network (PDN), facilitating compliance with impedance goals in a user-friendly setting. With its robust features, HyperLynx empowers engineers to create high-performance designs with confidence.

The Cadence AWR Design Environment Platform streamlines the development processes of RF and microwave products by utilizing design automation to boost engineering efficiency and minimize turnaround times. This platform, which is fully integrated, equips engineers with sophisticated high-frequency circuit and system simulation tools, alongside in-design electromagnetic (EM) and thermal analyses, ultimately producing high-frequency intellectual property that is both efficient and precise. Its user-friendly interface is not only robust but also intuitive, allowing for smart and customizable design workflows tailored to meet the specific demands of modern high-frequency semiconductor and PCB technologies. Furthermore, a cohesive design capture system supports a seamless front-to-back physical design workflow, where electrical and layout design entries are interconnected, ensuring that any component placed in an electrical schematic automatically updates the corresponding physical layout in synchronization. This capability significantly enhances collaboration among engineering teams and fosters a more agile development environment.

Enhance product development and accelerate the launch process with FLOW-3D, an exceptionally precise CFD software adept at addressing transient, free-surface challenges. Accompanied by our cutting-edge postprocessor, FlowSight, FLOW-3D offers a comprehensive multiphysics suite. This versatile CFD simulation platform empowers engineers to explore the dynamic interactions of liquids and gases across a diverse array of industrial sectors and physical phenomena. With a strong emphasis on multi-phase and free surface applications, FLOW-3D caters to various industries, including microfluidics, biomedical technology, civil water infrastructure, aerospace, consumer goods, additive manufacturing, inkjet printing, laser welding, automotive, offshore enterprises, and energy sectors. As a remarkably effective multiphysics resource, FLOW-3D combines functionality, user-friendliness, and robust capabilities to support engineers in achieving their modeling goals, ultimately driving innovation and efficiency in their projects. By leveraging FLOW-3D, organizations can overcome complex challenges and ensure that their designs are optimized for success in competitive markets.

Simcenter STAR-CCM+ is an advanced multiphysics computational fluid dynamics (CFD) software that enables the simulation of products in conditions that mimic real-life scenarios. This software stands out by incorporating automated design exploration and optimization into the CFD toolkit accessible to engineers. With a unified platform that encompasses CAD, automated meshing, multiphysics CFD capabilities, and advanced postprocessing, it empowers engineers to thoroughly investigate the entire design landscape, facilitating quicker and more informed design choices. By leveraging the insights offered by Simcenter STAR-CCM+, the design process becomes more strategic, ultimately resulting in innovative products that surpass customer expectations. Enhancing a battery's performance across its complete operating spectrum is a complex endeavor that necessitates the concurrent optimization of various parameters. In this context, Simcenter delivers a comprehensive simulation environment tailored for the analysis and design of electrochemical systems, fostering a deeper understanding of their behavior. This holistic approach allows engineers to tackle intricate challenges with confidence and precision.

PathWave ADS streamlines the design process by providing integrated templates that help users start their projects more efficiently. With a comprehensive selection of component libraries, locating the desired parts becomes a straightforward task. The automatic synchronization with layout offers a clear visualization of the physical arrangement while you create schematic designs. This data-driven approach enables teams to assess if their designs are in line with specifications. PathWave ADS enhances design confidence through its display and analytics features, which generate informative graphs, charts, and diagrams. Users can expedite their design process with the help of wizards, design guides, and templates. The complete design workflow encompasses schematic design, layout, as well as circuit, electro-thermal, and electromagnetic simulations. As frequencies and speeds continue to rise in printed circuit boards (PCBs), ensuring signal and power integrity is critical. Issues arising from transmission line effects can lead to electronic device failures. It is essential to model traces, vias, and interconnects accurately for a realistic simulation of the board, ensuring that potential problems are identified and mitigated early in the design phase. This multifaceted approach not only improves efficiency but also enhances the overall reliability of electronic designs.

Ansys Nuhertz filterSolutions automates RF, microwave, and digital filter design, optimization, and synthesis in a simple and efficient process. FilterSolutions takes your specifications for filter performance, synthesizes lumped components and physical layout realizations, then automatically sets up filter analysis in the Ansys HFSS electromagnetic sim. Ansys Nuhertz FilterSolutions significantly speeds up the design and fabrication of planar and lumped elements (surface mount). It also contains synthesis tools for digital, switched capacitor, and active filters. The netlist of active filters is available in SPICE format. C-code can be exported by the digital filter synthesis module for the generated filter.

SIwave is an advanced tool designed for analyzing power integrity, signal integrity, and electromagnetic interference in integrated circuit packages and printed circuit boards. It effectively addresses challenges related to power delivery systems and high-speed channels found in electronic devices. By enabling the modeling, simulation, and validation of high-speed channels and comprehensive power delivery systems, SIwave is essential for modern, high-performance electronics. The software precisely extracts multi-gigabit SERDES and memory buses to ensure compliance with product sign-off standards across various designs. Additionally, SIwave's full-wave extraction capabilities for complete power distribution networks (PDN) allow for the verification of noise margins and the assurance that impedance profiles are maintained, thanks to its automatic decoupling analysis tailored for low-voltage applications. This powerful tool not only enhances the design process but also significantly improves the reliability and efficiency of electronic products.

Adaptive Research is excited to unveil the CAESIM 2024 simulation platform, which is now available for immediate use, featuring enhanced computational fluid dynamics modeling along with multi-physics functionalities. This latest software version introduces innovative tools and features designed to streamline the modeling process, enabling CFD engineers to achieve rapid simulation results with greater efficiency. Additionally, the platform aims to enhance user experience through improved interfaces and capabilities.

OnScale stands out as the pioneering platform for Cloud Engineering Simulation, merging advanced multiphysics solver technology with the boundless computational capabilities of cloud supercomputers. This innovative solution empowers engineers to execute a vast array of full 3D multiphysics simulations concurrently, enabling the creation of authentic Digital Prototypes that represent the complete operational behavior of intricate high-tech devices. With the aim of delivering an exceptional Cloud Engineering Simulation experience, OnScale Solve is designed to be intuitive, robust, and effective. It operates seamlessly on both public and private cloud supercomputers and features a user-friendly web interface, an API for smooth integration into existing design processes, customizable scripting options for tailored engineering simulations, and plugins that expand its modeling functionalities. Furthermore, OnScale Solve equips engineers with the capability to synthetically generate data crucial for training advanced AI/ML algorithms, thereby enhancing innovation in technology development. This comprehensive platform ensures that engineers have the tools they need to push the boundaries of simulation and design.

In industries where the integrity of welded structures is critical, TRANSWELD® provides a cutting-edge and comprehensive solution for predicting potential welding imperfections. This advanced simulation software employs multi-physical models to accurately reflect the actual behavior of metal in both liquid and mushy phases, enabling an in-depth analysis of material transformations. Furthermore, TRANSWELD® facilitates the examination of the microstructure in solid-state assemblies. With this tool, you can ensure that your welded components meet required standards without the need for physical prototypes. Our software is entirely predictive, allowing users to digitally observe welding processes under realistic conditions. For instance, it enables the visualization of the heat source movement during simulations of techniques such as laser welding or arc welding, enhancing understanding and efficiency in the welding process. Such capabilities not only streamline production but also significantly reduce the risk of defects in the final product.

Energy2D is an interactive multiphysics simulation program grounded in computational physics, designed to model the three primary modes of heat transfer: conduction, convection, and radiation, while also integrating particle dynamics. This software operates efficiently on a wide range of computers, simplifying the process by removing the need for switches between preprocessors, solvers, and postprocessors that are usually necessary for computational fluid dynamics simulations. Users can create "computational experiments" to explore scientific hypotheses or address engineering challenges without the need for intricate mathematical formulations. Additionally, development is ongoing to introduce various energy transformation types and to enhance support for different fluid types. While Energy2D excels in accurately modeling conduction, its representations of convection and radiation are not entirely precise, which means results involving these elements should be regarded as qualitative. Over 40 scientific papers have utilized Energy2D as a valuable research instrument, showcasing its adoption in the academic community. As the program evolves, its capabilities are expected to expand further, potentially offering more comprehensive insights into complex physical interactions.

VSim is a sophisticated Multiphysics Simulation Software tailored for design engineers and research scientists who seek accurate solutions for complex challenges. Its exceptional integration of Finite-Difference Time-Domain (FDTD), Particle-in-Cell (PIC), and Charged Fluid (Finite Volume) methodologies ensures reliable outcomes across various applications, including plasma modeling. As a parallel software tool, VSim adeptly tackles large-scale problems, with simulations that execute rapidly thanks to algorithms optimized for high-performance computing environments. Renowned by researchers in over 30 countries and utilized by professionals across fields such as aerospace and semiconductor manufacturing, VSim guarantees results with verified accuracy that users can depend on. Developed by a dedicated group of computational scientists, Tech-X’s software has garnered thousands of citations in scientific literature, and VSim is prominently featured in many leading research institutions worldwide. Furthermore, its continued evolution reflects the commitment to meeting the ever-growing demands of modern scientific inquiry.

Examine RF and microwave circuits and systems using rapid simulation and robust optimization tools that enhance your design process. Delve into performance trade-offs through the integration of automatic circuit synthesis technology. PathWave RF Synthesis (Genesys) offers foundational features that cater to all designers of RF and microwave circuit boards and subsystems. With PathWave Circuit Design, you can uncover RF design mistakes that conventional spreadsheet analyses often overlook. This introductory design platform, which encompasses circuit, system, and electromagnetic simulators, enables you to approach design reviews with greater assurance prior to the realization of hardware. With just a few clicks, you can observe the automatic synthesis and optimization of your matching network. After that, easily transfer your design to PathWave Advanced Design System (ADS) to incorporate it into more intricate designs, ensuring seamless integration and enhanced functionality. By leveraging these tools, you can streamline the design process and enhance the overall efficiency of your RF and microwave projects.

Ansys Maxwell serves as an electromagnetic field solver tailored for applications involving electric machines, transformers, wireless charging systems, permanent magnet latches, actuators, and various electromechanical devices. It effectively analyzes static, frequency-domain, and time-varying electric and magnetic fields. The software also provides specialized design tools specifically for electric machines and power converters. With Maxwell, users can accurately assess the nonlinear and transient behavior of electromechanical elements and their impacts on drive circuits and control system architectures. By utilizing Maxwell’s sophisticated electromagnetic field solvers and integrating them with circuit and systems simulation technologies, users can gain insights into the performance of electromechanical systems prior to constructing a physical prototype. Additionally, Maxwell is recognized for delivering reliable simulations of low-frequency electromagnetic fields found in industrial applications, ensuring optimal design and functionality in real-world scenarios. This capability makes it an essential tool for engineers looking to refine their designs and improve overall system performance.

PrimeSim HSPICE circuit sim is the industry's standard for circuit simulation. It features foundry-certified MOS model models with state of the art simulation and analysis algorithms. HSPICE, with over 25 years of success in design tape outs and a comprehensive circuit simulator, is the industry's most trusted. On-chip simulation: analog designs, RF, custom digital, standard cell design and character, memory design and characterisation, device model development. For off-chip signal integrity simulation, silicon-to-package-to-board-to-backplane analysis and simulation. HSPICE is a key component of Synopsys analog/mixed signal (AMS) verification suite. It addresses the most important issues in AMS verification. HSPICE is the industry's standard for circuit simulation accuracy and offers MOS device models that have been foundry-certified. It also includes state-of-the art simulation and analysis algorithms.

Electromagnetic (EM) simulation provides valuable insights prior to the physical prototyping stage. Tailor your EM simulations to enhance both speed and precision. Seamlessly integrate EM analysis with your circuit simulations to boost overall efficiency. While EM simulations can often require several hours to complete, you can significantly reduce both import and export times by linking your EM simulation software with PathWave Circuit Design software. This integration allows you to maximize your workflow by combining EM analysis with circuit simulations effectively. The 3D EM solid modeling environment enables the creation of custom 3D objects and supports the import of existing models from various CAD platforms. This is essential for preparing a 3D geometry for 3DEM simulation, which involves defining ports, boundary conditions, and material properties. Additionally, the environment includes a Finite Difference Time Domain (FDTD) simulator, which is vital for compliance testing regarding Specific Absorption Rate (SAR) and Hearing Aid Compatibility (HAC), ensuring that your designs meet necessary regulatory standards. By utilizing these advanced features, you can streamline your design process and enhance the effectiveness of your electromagnetic analysis.

Ansys Totem-SC stands as the established leader in the field of power noise and reliability verification for analog and mixed-signal designs, leveraging cloud-native elastic compute infrastructure for enhanced performance. Renowned as the gold standard in voltage drop and electromigration multiphysics sign-off, it is tailored for both transistor-level and mixed-signal designs. With countless successful tapeouts to its credit, the cloud-focused architecture of Totem-SC ensures rapid and robust full-chip analysis capabilities. Its signoff precision is endorsed by all leading foundries for advanced finFET technologies, reaching down to 3nm nodes. Serving as an analytical platform for power noise and reliability, Ansys Totem-SC effectively addresses the needs of analog mixed-signal IP and fully custom designs. The platform is adept at generating IP models for SOC-level power integrity signoff in conjunction with RedHawk-SC, as well as creating compact chip models of power delivery networks applicable at both chip and system levels. This industry-endorsed solution sets a benchmark for analog and mixed-signal EM/IR analysis, ensuring reliability and performance for modern electronic designs. Overall, Ansys Totem-SC is essential for engineers seeking to optimize design integrity in cutting-edge technology.

Effortlessly combine COMSOL Multiphysics® with MATLAB® to broaden your modeling capabilities through scripting within the MATLAB framework. The LiveLink™ for MATLAB® feature empowers you to access the comprehensive functionalities of MATLAB and its various toolboxes for tasks such as preprocessing, model adjustments, and postprocessing. Elevate your custom MATLAB scripts by integrating robust multiphysics simulations. You can base your geometric modeling on either probabilistic elements or image data. Furthermore, leverage multiphysics models alongside Monte Carlo simulations and genetic algorithms for enhanced analysis. Exporting COMSOL models in a state-space matrix format allows for their integration into control systems seamlessly. The COMSOL Desktop® interface facilitates the utilization of MATLAB® functions during your modeling processes. You can also manipulate your models via command line or scripts, enabling you to parameterize aspects such as geometry, physics, and the solution approach, thus boosting the efficiency and flexibility of your simulations. This integration ultimately provides a powerful platform for conducting complex analyses and generating insightful results.

Enhance engineering processes with the only comprehensive and user-friendly CFD platform designed for multidisciplinary design and optimization. Computational fluid dynamics (CFD) plays a crucial role in multiphysics system analysis, allowing for the simulation of fluid behavior and thermodynamic characteristics through advanced numerical models. Engineers leverage the Cadence Fidelity CFD platform for various design tasks, including propulsion, aerodynamics, hydrodynamics, and combustion, to enhance product efficiency while minimizing the need for costly and time-intensive physical testing. This robust Fidelity CFD platform offers a seamless end-to-end solution tailored for applications across aerospace, automotive, turbomachinery, and marine sectors. With its efficient workflows, massively parallel architecture, and cutting-edge solver technology, the platform delivers remarkable performance and accuracy, significantly boosting engineering productivity in addressing contemporary design challenges. Ultimately, Fidelity stands out by not only simplifying complex processes but also enabling engineers to innovate rapidly and effectively.

Ansys SPEOS evaluates the lighting and optical capabilities of various systems, effectively reducing both prototyping expenses and timelines while enhancing product efficiency. With a user-friendly and detailed interface, Ansys SPEOS boosts productivity by leveraging GPU technology for simulation previews, providing seamless integration with the Ansys multiphysics platform. The software has undergone evaluation by the International Commission on Illumination (CIE) using the CIE 171:2006 test cases, confirming the precision of its light modeling and highlighting the advantages of utilizing Ansys SPEOS. Illuminate your virtual models and effortlessly investigate the 3D light propagation. Featuring the SPEOS Live preview function, this tool incorporates advanced simulation and rendering features, allowing for interactive product design. By ensuring accurate simulations on the first attempt, you can significantly reduce iteration times and enhance your decision-making process, facilitating the automatic design of optical surfaces, light guides, and lenses. This innovative approach not only streamlines workflows but also leads to higher-quality outcomes in optical engineering projects.

Inventor® Nastran® is a finite element analysis (FEA) tool integrated within CAD software, enabling engineers and analysts to perform a diverse range of studies using various materials. This software provides comprehensive simulation capabilities that encompass both linear and nonlinear stress analysis, dynamic simulations, and heat transfer assessments. It is exclusively accessible through the Product Design & Manufacturing Collection, which includes a suite of powerful tools designed to enhance workflows within Inventor. In addition to advanced simulation features, this collection also offers 5-axis CAM, nesting tools, and access to software like AutoCAD and Fusion 360, ensuring a holistic approach to product design and manufacturing processes. By utilizing Inventor Nastran, professionals can streamline their analysis and improve their design outcomes significantly.

Simcenter MAGNET serves as an advanced simulation tool for analyzing electromagnetic fields, enabling users to predict the performance of various components such as motors, generators, sensors, transformers, actuators, and solenoids that involve permanent magnets or coils. By facilitating low-frequency electromagnetic field simulations, Simcenter MAGNET offers comprehensive modeling capabilities that accurately represent the underlying physics of electromagnetic devices. Among its features are the modeling of manufacturing processes, temperature-sensitive material properties, and the intricate behavior of magnetization and de-magnetization, along with vector hysteresis models. The software’s built-in motion solver incorporates a six-degree-of-freedom functionality, which allows for the precise modeling and analysis of complex scenarios such as magnetic levitation and intricate motion dynamics. This advanced capability is bolstered by innovative smart re-meshing technology, ensuring that even the most challenging electromagnetic problems can be effectively addressed. Consequently, Simcenter MAGNET stands out as an essential tool for engineers and designers looking to optimize electromagnetic systems in a range of applications.

XGtd is an advanced electromagnetic analysis software that utilizes ray-based methodologies to evaluate how vehicles or vessels influence antenna radiation, forecast antenna coupling, and estimate radar cross-section. This tool is particularly advantageous for high-frequency applications or extensive platforms, as it effectively addresses scenarios where comprehensive physics-based methods may demand more computational power than is available. Beyond conventional ray tracing, XGtd integrates several sophisticated techniques, such as Geometric Optics (GO), the Uniform Theory of Diffraction (UTD), Physical Optics (PO), and the Method of Equivalent Currents (MEC). The software excels in delivering precise and personalized outputs for its specific applications, achieving high-fidelity field predictions even in shadow zones where creeping wave effects occur. Additionally, XGtd is capable of performing detailed multipath calculations that encompass various factors, including reflections, transmissions, wedge diffractions, surface diffractions, and creeping waves, making it an invaluable tool in the field of electromagnetic analysis. Its versatility and precision allow for a comprehensive understanding of complex interactions in challenging environments.

Cadence®, Sigrity X PowerSI® technology helps you to tackle increasingly difficult issues related switching noise, signal coupling and target voltage levels. It provides fast, accurate and detailed electrical analyses of full IC packages and PCBs. It can be used to develop power and signal integrity guidelines before layout, or after layout to verify performance and improve the design without a prototype. Sigrity X's electromagnetic (EM) solver technology allows you to perform a wide range of studies, including identifying trace and via coupling problems, power/ground fluctuation caused by simultaneously switching out put, and designing regions that are below or above voltage targets. PowerSI technology allows you to extract frequency-dependent parameter models for network networks and visualize complex spatial relationships.

The Synopsys PrimeWave Design Environment serves as a robust and adaptable platform powered by AI for setting up simulations and analyzing various designs, including analog, RF, mixed-signal, custom-digital, and memory designs found within the Synopsys Custom Design Family. It provides an integrated simulation experience that interacts smoothly with all Synopsys PrimeSim simulation engines, enhancing productivity and user-friendliness while offering thorough analytical tools. Functioning as a vital element of the Synopsys AI-Driven Analog Design solution, this environment efficiently optimizes intricate analog designs by navigating through multiple test-benches and numerous process-voltage-temperature (PVT) corners, allowing engineers to swiftly identify design points that align with their requirements. Furthermore, the PrimeWave Design Environment includes a cohesive, workflow-oriented analysis for all PrimeSim Reliability Analysis tools, featuring user-friendly setup, clear visualizations, and capabilities for debugging and identifying root causes, ultimately fostering a design approach that emphasizes reliability. This multifaceted design environment not only improves the efficiency of engineering processes but also empowers users to make informed decisions throughout the design lifecycle.

Sigrity X Advanced SI Technology offers advanced signal integrity analysis for PCBs and IC packaging, covering DC up to 56GHz, with features such as automated die-todie SI analysis, topology exploring, and simulation of high-speed interfaces. It supports IBIS-AMI and customizable compliance kits to ensure that your designs meet rigorous standards.

Hole & 2-Axis Tactics can significantly reduce programming times by up to 70% by automatically generating toolpaths that are ready for manufacturing. With over 40 types of machining operations at your disposal, you can efficiently tackle any manufacturing project with confidence. Whether you're working with Nurbs or STL geometries, creating the desired toolpaths—including undercut options—is a straightforward process. The 5-axis milling system offers a comprehensive approach for both indexing and 4 to 5-axis machining, while also being compatible with STL files. A wide range of advanced functions such as Swarf, Drive Curve, Drive Surface, Flow Cut, Side Cut, and Point Control are included to enhance machining versatility in various situations. Additionally, a suite of verification and simulation tools ensures that the machining process is feasible, reliable, and safe. For instance, Solid Verify allows users to simulate the actual machining to assess material excess, ensuring that the machining is not only effective but also efficient, leading to superior production outcomes. Moreover, this combination of tools and functionalities helps optimize the entire manufacturing workflow, making it easier to achieve high-quality results consistently.

Design Force is a revolutionary innovation in electrical design. It allows you to break down the boundaries of your electrical design process. The process of designing a product is becoming more complex. This often involves technologies that are difficult or impossible to use ECAD tools to address. Design Force allows design teams to access system-level design information as early as the planning and conceptual phases. This allows them to layout each product board while simultaneously considering the entire system view. Design Force uses the most current industry hardware and software. Users can design in a native 3D environment. This allows them to achieve optimal performance by using native 64-bit, multithreading, multicore processors. Design Force is compatible with multiple client-server implementations. You can also work from your corporate cloud.

HyperWorks offers easy-to-learn and effective workflows that leverage domain expertise and increase team productivity. This allows for efficient development of today's complex and connected products. Engineers can now move seamlessly from one domain to another with the new HyperWorks experience. They can even create reports without ever leaving the model. HyperWorks allows you to create, explore, and optimize designs. These designs can accurately model structures, mechanisms and fluids as well as electrical, embedded software, systems designs, and manufacturing processes. The solution-specific workflows improve a variety of engineering processes, including fatigue analysis, CFD modeling, concept design optimization, design exploration, and CFD modeling. Each interface is intuitive and well-designed, and differentiated for each user. It's also consistent and easy to use.

NVIDIA Modulus is an advanced neural network framework that integrates the principles of physics, represented through governing partial differential equations (PDEs), with data to create accurate, parameterized surrogate models that operate with near-instantaneous latency. This framework is ideal for those venturing into AI-enhanced physics challenges or for those crafting digital twin models to navigate intricate non-linear, multi-physics systems, offering robust support throughout the process. It provides essential components for constructing physics-based machine learning surrogate models that effectively merge physics principles with data insights. Its versatility ensures applicability across various fields, including engineering simulations and life sciences, while accommodating both forward simulations and inverse/data assimilation tasks. Furthermore, NVIDIA Modulus enables parameterized representations of systems that can tackle multiple scenarios in real time, allowing users to train offline once and subsequently perform real-time inference repeatedly. As such, it empowers researchers and engineers to explore innovative solutions across a spectrum of complex problems with unprecedented efficiency.

Utilizing the Ansys Electronics solution suite significantly reduces testing expenses, guarantees adherence to regulatory standards, enhances reliability, and greatly shortens your product development timeline. This approach not only facilitates the creation of top-tier and innovative products but also empowers you to address the most crucial elements of your designs through advanced simulation capabilities. Whether you're involved in antenna, RF, microwave, PCB, package, IC design, or electromechanical devices, our industry-leading simulators are at your disposal. These tools effectively tackle challenges related to electromagnetic interference, thermal management, signal integrity, power integrity, parasitic effects, cabling, and vibrations within your designs. Moreover, our comprehensive product simulation offers you the opportunity to achieve first-pass success in designing various systems, including airplanes, vehicles, smartphones, laptops, wireless chargers, and more, ensuring that your projects are not only successful but also innovative. As a result, you can confidently bring your ideas to fruition with efficiency and accuracy.

DigitalClone for Additive Manufacturing (DCAM) is a comprehensive suite of metal additive manufacturing simulation and modeling capabilities that allows for seamless design and analysis support. DC-AM uses a multiscale, multi-physics analysis approach to link the process - microstructure and fatigue relationship of additively produced parts to enable computational assessment for quality and performance. DC-AM encourages the adoption of AM in safety-critical sectors by providing unprecedented insight into build conditions and the characteristics and final parts. This allows for a reduction in time and cost, as well as allowing for a reduction in the time and costs required to qualify parts.

The mesh significantly impacts the precision, convergence, and speed of a simulation. Ansys offers a variety of tools designed to create the most suitable mesh for achieving precise and efficient solutions. Their software includes general-purpose, high-performance, and automated meshing solutions that cater to multiphysics applications, ranging from simple automatic meshing to meticulously crafted designs. Integrated smart defaults within the software simplify the meshing process, ensuring it is straightforward and intuitive, while providing the necessary resolution to effectively capture solution gradients for reliable outcomes. Ansys's meshing offerings include an array of options, from automated approaches to custom-tailored meshes. The methods available encompass a broad spectrum, featuring everything from high-order to linear elements and quick tetrahedral and polyhedral options, to high-quality hexahedral and mosaic configurations. By utilizing Ansys's advanced meshing capabilities, users can significantly minimize the time and effort required to achieve accurate results, ultimately enhancing overall productivity in the simulation process.

SwiftComp is an innovative composite simulation software that combines multiscale and multiphysics capabilities to provide the precision of 3D finite element analysis (FEA) with the simplicity of basic engineering models. This groundbreaking tool simplifies the modeling process for engineers, allowing them to treat composites with the same ease as metals while maintaining accuracy and capturing intricate microstructural details. It offers cohesive modeling for structures that are one-dimensional (like beams), two-dimensional (such as plates or shells), and three-dimensional, effectively calculating the material properties required. Users can utilize SwiftComp independently for virtual composite testing or as an enhancement to existing structural analysis tools, thereby integrating high-fidelity composite modeling into their workflows. Additionally, SwiftComp excels in determining the optimal structural model for macroscopic analysis and includes capabilities for dehomogenization, which enables the calculation of pointwise stresses within the microstructure. It seamlessly connects with established software such as ABAQUS and ANSYS, further broadening its applicability in engineering projects. As a result, SwiftComp significantly enhances the efficiency and effectiveness of composite material modeling in various engineering applications.

Fusion 360 seamlessly integrates design, engineering, electronics, and manufacturing into one cohesive software environment. It offers a comprehensive suite that combines CAD, CAM, CAE, and PCB capabilities within a single development platform. Additionally, users benefit from features like EAGLE Premium, HSMWorks, Team Participant, and various cloud-based services, including generative design and cloud simulation. With an extensive range of modeling tools, engineers can effectively design products while ensuring their form, fit, and function through multiple analysis techniques. Users can create and modify sketches using constraints, dimensions, and advanced sketching tools. It also allows for editing or fixing imported geometry from other file formats with ease. Design modifications can be made without concern for time-dependent features, enabling flexibility in the workflow. Furthermore, the software supports the creation of intricate parametric surfaces for tasks such as repairing or designing geometry, while history-based features like extrude, revolve, loft, and sweep dynamically adapt to any design alterations made. This versatility makes Fusion 360 an essential tool for modern engineering practices.

ColdStream is a cutting-edge cloud-based platform for thermal simulation engineering that streamlines every aspect of your thermal management and cooling design workflow, covering everything from thermal analysis to the creation of thermal designs. With Diabatix's advanced thermal simulation software, your organization can accelerate product development by leveraging the latest technology available. Gain crucial insights into heat transfer, including temperature distribution, heat dissipation, fluid dynamics, thermal resistance, thermal radiation, cooling capacity, and much more. Instead of wasting time searching for the most effective heat sinks to manage the cooling of your electronic devices and products, allow ColdStream to handle the process for you. You can simply upload your geometry, configure the necessary operating conditions for the thermal simulation, and establish your heat sink design goals with just a few clicks, making the process remarkably efficient and user-friendly. This innovative approach not only saves time but also enhances the accuracy and effectiveness of your thermal management solutions.

In today's fast-paced business environment, companies encounter intricate design obstacles while managing limited budgets. eCADSTAR transcends being just a PCB layout tool, as it integrates simulation, 3D MCAD capabilities, and wire harness support, all harnessed through cutting-edge technology that offers enterprise-level performance at a budget-friendly price point. Its user-friendly interface makes eCADSTAR an attractive choice for designers of all levels. By utilizing eCADSTAR’s robust design features, teams can streamline and expedite the overall design workflow. The software includes a digitally connected library and intuitive schematic capture, allowing PCB layout engineers to focus more on innovation and less on tool manipulation. Among the various stages of the design process, developing a test plan can be particularly labor-intensive. Without proper upfront simulation, the validation phase can lead to significant time and financial expenditures, but eCADSTAR addresses this challenge with its advanced capabilities in Spice simulation and SI/PI analysis, resulting in reduced test cycle times and increased efficiency overall. Ultimately, eCADSTAR stands out as a powerful ally for engineers striving to navigate the complexities of modern design.

Autodesk CFD is a sophisticated software for computational fluid dynamics that allows engineers and analysts to effectively forecast the behavior of fluids, both liquids, and gases. By utilizing Autodesk CFD, teams can significantly reduce the reliance on physical prototypes, gaining valuable insights into the performance of fluid flow designs. This software offers a suite of robust tools aimed at optimizing system design, including the analysis of fluid movement and thermal management for cooling electronic devices. It also facilitates Building Information Modeling (BIM) integration to enhance occupant comfort in HVAC systems within architecture, engineering, and construction (AEC) and mechanical, electrical, and plumbing (MEP) sectors. The Application Programming Interface (API) and scripting capabilities enhance Autodesk CFD's functionality, enabling users to customize and automate routine tasks via the Decision Center. Additionally, the Decision Center streamlines the process of comparing system designs, thereby accelerating decision-making related to design choices. This comprehensive approach ensures that engineers are equipped with the necessary tools to achieve higher efficiency and innovation in their projects.