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Description

The extreme-density architecture of the 3U or 6U blade servers is both powerful and adaptable, featuring designs that accommodate up to four independent UP nodes per blade. These servers achieve remarkable power efficiency of up to 86% and density improvements of 56% when juxtaposed with conventional 1U rackmount servers. Each node can support up to 256GB of DDR4 memory across eight DIMM slots, ensuring robust performance. Additionally, they come equipped with high-efficiency AC/DC power supplies rated at Platinum and Titanium levels (96%), and optional Battery Backup Power (BBP®) support enhances reliability. The architecture allows for dual Intel® Xeon® processor E5-2600 v4/v3 families, along with a capacity for four 2.5" SAS3/SATA3 drives per blade server and up to two M.2 NVMe drives on specific models. A shared infrastructure for cooling, power, and networking is crucial for the impressive density and efficiency that blade servers provide. Furthermore, Supermicro’s MicroBlade initiative advances the resource-saving concept with its Disaggregated Server Design, allowing for independent upgrades of compute modules while maintaining the rest of the server infrastructure, which significantly optimizes total cost of ownership. This innovative approach not only enhances flexibility but also ensures that users can adapt their systems to evolving needs without major overhauls.

Description

The 3U systems can accommodate 24, 12, or 8 nodes, featuring 4 DIMM slots each, with options for hot-swappable 3.5” or 2.5” NVMe/SAS3/SATA3 drives. Enhanced by onboard 10 Gigabit Ethernet, these systems are designed for optimal cost-effectiveness. The MicroCloud’s modular design ensures high density, ease of maintenance, and affordability, which are critical for modern hyper-scale operations. Integrated within a compact 3U chassis measuring under 30 inches in depth, these modular server nodes can save over 76% of rack space compared to conventional 1U servers. This family of MicroCloud servers specializes in single socket computing, optimized for hyper-scale data centers, utilizing the latest power-efficient and high-density system-on-chip (SoC) processors, including the Intel® Xeon® E/D/E3/E5 and Intel® Atom® C Processors, allowing for diverse and scalable cloud and edge computing solutions. Conveniently, power and I/O ports are positioned at the front of the chassis, facilitating quick server provisioning, upgrades, and maintenance tasks, enhancing operational efficiency further.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

RAVEL Orchestrate
Relianoid

Integrations

RAVEL Orchestrate
Relianoid

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Supermicro

Country

United States

Website

www.supermicro.com/en/products/microblade

Vendor Details

Company Name

Supermicro

Country

United States

Website

www.supermicro.com/en/products/microcloud

Product Features

Product Features

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