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ease
features
design
support

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Description

Our top-tier CIARA ORION High Density (HD) servers, available in single or dual socket configurations, deliver exceptional flexibility, scalability, and efficiency to manage all your essential workloads. With the highest density of cores per rackmount unit in the industry, ORION HD products ensure optimal utilization of space within any data center. Designed to be compatible with both Intel® Xeon® Processor Scalable Family and AMD EPYC® processors, these servers present remarkable design possibilities for the large-scale deployment of high-density IT and HPC workloads. The ORION high-density server range incorporates cutting-edge silicon technology to ensure top performance and supports the highest thermal design power (TDP) in the market, along with a wide variety of storage options and extensive support for add-on cards. Perfect for infrastructure consolidation, academic research, cloud and hosting services, as well as applications requiring high-performance computing, these servers stand out as a robust solution. Furthermore, their adaptability across various sectors makes them a vital choice for organizations aiming to enhance their computational capabilities.

Description

Providing adaptable performance options tailored for data centers of varying sizes, this system supports advanced storage technologies such as E3.S and E1.S, PCIe Gen5, and CXL. It sets a new standard for power efficiency by enhancing PSU density by as much as 4%. Promoting open collaboration significantly boosts product reliability and operational efficiency. An increase in redundancy for BIOS/BMC and critical components ensures stable performance, while enhanced security measures such as boot memory inspection and MFP memory protection fortify system integrity. Software-designed hardware redundancy minimizes both system downtime and energy consumption. Cloud-driven operations and maintenance achieve fault diagnosis accuracy of up to 95%. Comprehensive liquid cooling solutions are in place, alongside intelligent temperature management and hardware designs that optimize heat dissipation. Innovative packing technology leads to a 90% reduction in material volume and a 30% decrease in plastic waste. Additionally, dynamic power management facilitates a 15% reduction in energy use, all while providing real-time monitoring of carbon emissions. As a result, this holistic approach not only enhances performance but also drives sustainability in data center operations.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

No details available.

Integrations

No details available.

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Hypertec

Country

Canada

Website

hypertec.com/ciara/high-density-server/

Vendor Details

Company Name

Inspur

Country

United States

Website

www.inspursystems.com/g7-series/

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