Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Our top-tier CIARA ORION High Density (HD) servers, available in single or dual socket configurations, deliver exceptional flexibility, scalability, and efficiency to manage all your essential workloads. With the highest density of cores per rackmount unit in the industry, ORION HD products ensure optimal utilization of space within any data center. Designed to be compatible with both Intel® Xeon® Processor Scalable Family and AMD EPYC® processors, these servers present remarkable design possibilities for the large-scale deployment of high-density IT and HPC workloads. The ORION high-density server range incorporates cutting-edge silicon technology to ensure top performance and supports the highest thermal design power (TDP) in the market, along with a wide variety of storage options and extensive support for add-on cards. Perfect for infrastructure consolidation, academic research, cloud and hosting services, as well as applications requiring high-performance computing, these servers stand out as a robust solution. Furthermore, their adaptability across various sectors makes them a vital choice for organizations aiming to enhance their computational capabilities.
Description
Providing adaptable performance options tailored for data centers of varying sizes, this system supports advanced storage technologies such as E3.S and E1.S, PCIe Gen5, and CXL. It sets a new standard for power efficiency by enhancing PSU density by as much as 4%. Promoting open collaboration significantly boosts product reliability and operational efficiency. An increase in redundancy for BIOS/BMC and critical components ensures stable performance, while enhanced security measures such as boot memory inspection and MFP memory protection fortify system integrity. Software-designed hardware redundancy minimizes both system downtime and energy consumption. Cloud-driven operations and maintenance achieve fault diagnosis accuracy of up to 95%. Comprehensive liquid cooling solutions are in place, alongside intelligent temperature management and hardware designs that optimize heat dissipation. Innovative packing technology leads to a 90% reduction in material volume and a 30% decrease in plastic waste. Additionally, dynamic power management facilitates a 15% reduction in energy use, all while providing real-time monitoring of carbon emissions. As a result, this holistic approach not only enhances performance but also drives sustainability in data center operations.
API Access
Has API
No
API Access
Has API
No
Integrations
No details available.
Integrations
No details available.
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Vendor Details
Company Name
Hypertec
Country
Canada
Website
hypertec.com/ciara/high-density-server/
Vendor Details
Company Name
Inspur
Country
United States
Website
www.inspursystems.com/g7-series/