Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys Totem-SC stands out as the established and reliable leader in the realm of power noise and reliability validation for both analog and mixed-signal designs, utilizing a cloud-native elastic compute framework. Recognized as the benchmark solution for voltage drop and electromigration multiphysics sign-off at the transistor level, Ansys Totem-SC has proven its effectiveness across numerous tapeouts, leveraging a cloud-based infrastructure to provide the necessary speed and capacity for comprehensive full-chip assessments. Its accuracy in signoff has been validated by all major foundries, supporting advanced finFET technologies down to 3nm. This platform excels in power noise and reliability analysis specifically for analog mixed-signal intellectual property and fully custom designs. Moreover, it generates IP models that facilitate SOC-level power integrity signoff in conjunction with RedHawk-SC and develops compact chip models for power delivery networks applicable at both chip and system levels. The solution is not only industry-proven but also certified by foundries, making it a highly regarded choice for analog and mixed-signal electromigration and IR analysis. With Ansys Totem-SC, designers can confidently ensure the integrity and reliability of their power delivery systems throughout the design process.
Description
DigitalClone for Additive Manufacturing (DCAM) is a comprehensive suite of metal additive manufacturing simulation and modeling capabilities that allows for seamless design and analysis support. DC-AM uses a multiscale, multi-physics analysis approach to link the process - microstructure and fatigue relationship of additively produced parts to enable computational assessment for quality and performance.
DC-AM encourages the adoption of AM in safety-critical sectors by providing unprecedented insight into build conditions and the characteristics and final parts. This allows for a reduction in time and cost, as well as allowing for a reduction in the time and costs required to qualify parts.
API Access
Has API
No
API Access
Has API
No
Integrations
No details available.
Integrations
No details available.
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Pricing Details
Upon request
Depending on AWS non-government and government operations
Free Trial
No
Free Version
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
Yes
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
No
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
Yes
In Person
No
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
Yes
In Person
Yes
Vendor Details
Company Name
Ansys
Founded
1970
Country
United States
Website
www.ansys.com/products/semiconductors/ansys-totem
Vendor Details
Company Name
Sentient Science
Founded
2001
Country
United States
Website
sentientscience.com
Product Features
Simulation
1D Simulation
No
3D Modeling
No
3D Simulation
No
Agent-Based Modeling
No
Continuous Modeling
No
Design Analysis
No
Direct Manipulation
No
Discrete Event Modeling
No
Dynamic Modeling
No
Graphical Modeling
No
Industry Specific Database
No
Monte Carlo Simulation
No
Motion Modeling
No
Presentation Tools
No
Stochastic Modeling
No
Turbulence Modeling
No
Product Features
3D Printing
Analytics
No
Customizable Support Structures
No
ERP
No
Integrates with CAD
No
Mesh Analysis and Repair
No
Model Setup and Plating
No
Multi-User Support and Permissions
No
Multiple/Shared Print Queues
No
Pre-Print Simulations
Yes
Print File Creation
No
Slicing
No
Engineering
2D Drawing
No
3D Modeling
Yes
Chemical Engineering
No
Civil Engineering
No
Collaboration
No
Design Analysis
Yes
Design Export
No
Document Management
No
Electrical Engineering
No
Mechanical Engineering
Yes
Mechatronics
No
Presentation Tools
No
Structural Engineering
No