Compare Ansys Sherlock vs. VPS-MICRO

Ansys Sherlock stands out as the sole reliability physics-based tool for electronics design that delivers quick and precise life expectancy assessments for electronic components, boards, and systems during the initial design phases. By automating the design analysis process, Ansys Sherlock enables the rapid generation of life predictions, thus eliminating the "test-fail-fix-repeat" cycle that often hampers development. Designers can effectively model the interactions between silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies, allowing for accurate predictions of potential failure risks stemming from thermal, mechanical, and manufacturing stresses, all prior to creating prototypes. Additionally, Sherlock's extensive libraries, which house over 500,000 components, facilitate the seamless transformation of electronic computer-aided design (ECAD) files into computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each of these models is equipped with precise geometries and material properties, ensuring that stress information is accurately conveyed for reliable predictions. This capability not only enhances design efficiency but also significantly reduces the risk of costly errors in the later stages of product development.

VPS-MICRO estimates the lifespan of manufactured components by modeling the characteristics of their constituent materials. This innovative software is founded on three fundamental principles. First, durability is influenced not just by the stress applied but also by how the material responds to that stress. Second, the materials used in creating intricate components and systems often exhibit non-uniform properties. Lastly, computational resources are more cost-effective and quicker compared to traditional physical testing or prototyping methods. Building upon these concepts, VEXTEC’s VPS-MICRO® serves as a sophisticated computational tool that effectively considers a material’s response to imposed stress, its inherent variability, various damage mechanisms, geometric factors, and the operational conditions over time. Consequently, it produces a three-dimensional, time-sensitive simulation that reliably mirrors the real-world physics behind the onset, progression, and reasons for material damage, offering valuable insights for engineers and designers alike. This capability not only enhances understanding but also aids in improving the design and reliability of future products.